Lowprofile and very small size SMD Design, Wound Chip constructure with standard 0805 to 1812 size, with best EMI suppression effect but least impact to data signal wave .

Preventive measure against high speed signal radiation emissions such as USB 2.0, IEEE1394 or LAN interface. Best for NB.

WCM-2012-120T

WCM-2012-141T

WCM-2012-161T

WCM-2012-181T

WCM-2012-201T

WCM-2012-221T

WCM-2012-240T

WCM-2012-261T

WCM-2012-320T

WCM-2012-371T

WCM-2012-500T

WCM-2012-670T

WCM-2012-750T

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