Download the SC7777T datasheet PDF.
This datasheet also includes the SC7777D variant, as both parts are published together in a single manufacturer document.
Adjustment processes are decreased by function and ratio trimmings.
High density mounting by bonding (COB).
Various types of package are available.
High reliability achieved by KOA’s original thick film technology.
Thick film printed circuit substrate applies the non-noble metal paste (conductive paste and resistive paste) and receives the many total inquires including material selecting, pattern designing and mass production
EW ordering information.
SC7777T Datasheet
