BZT52C36
Features
Planar Die Construction 500m W Power Dissipation on Ceramic PCB General Purpose, Medium Current
Absolute Maximum Ratings (Ta = 25 )
Parameter Power dissipation Thermal Resistance, Junction to Ambient Air Forward Voltage @ IF = 10m A Jumction temperature Storage temperature
Symbol P
R JA VF Tj Tstg
Rating 500 250 0.9 150
-65 to +150
Unit m W
/W V
Electrical Characteristics (Ta = 25 )
Type
Zener voltage VZ (V)
Maximum Zener Impedance
Maximum Reverse Current
Typical Temperature Coefficient
@ IZTC m V/
Test Current
IZTC Marking
BZT52C2V0 BZT52C2V4 BZT52C2V7 BZT52C3V0 BZT52C3V3 BZT52C3V6 BZT52C3V9 BZT52C4V3 BZT52C4V7 BZT52C5V1
Nom.
Min.
Max.
IZ ZZT @ IZT ZZK @ IZK IZK
(m A) ( )
( ) (m A)
IR ( A)
@ VR (V)
Min.
Max.
2.0 1.91 2.09 5 100 600 1.0 150 1.0 -3.5 0
2.4 2.2 2.6 5 100 600 1.0 50 1.0 -3.5 0
2.7 2.5 2.9 5 100 600 1.0 20 1.0 -3.5 0
3.0 2.8 3.2 5 95 600 1.0 10 1.0 -3.5 0
3.3 3.1 3.5 5 95 600 1.0 5.0 1.0 -3.5 0
3.6 3.4 3.8 5 90 600 1.0 5.0 1.0 -3.5 0
3.9...
