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KA-3535ZG25Z4S Datasheet Preview

KA-3535ZG25Z4S Datasheet

SMD CHIP LED LAMP

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3.5x3.5 mm SMD CHIP LED LAMP
Part Number: KA-3535ZG25Z4S
Green
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
Description
Features
z White SMD package, silicone resin.
z Low thermal resistance.
z Compatible with IR-reflow processes.
z ESD protection.
z Package: 2000pcs / reel.
z Moisture sensitivity level : level 2a.
z RoHS compliant.
The Green source color devices are made with InGaN on
Al2O3 substrate Light Emitting Diode.
Static electricity and surge damage the LEDS.
It is recommended to use a wrist band or anti-electrostatic
glove when handling the LEDs.
All devices, equipment and machinery must be electrically
grounded.
Applications
z Signal and symbol luminaire for orientation.
KingbrightPackage Dimensions
z Marker lights (e.g. steps, exit ways, etc).
z Decorative and entertainment lighting.
z Commercial and residential lighting.
z Automotive interior lighting.
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice.
4. The device has a single mounting surface. The device must be mounted according to the specifications.
SPEC NO: DSAM0801
APPROVED: WYNEC
REV NO: V.4B
CHECKED: Allen Liu
DATE: MAR/30/2013
DRAWN: F.Cui
PAGE: 1 OF 6
ERP: 1201005740




Kingbright

KA-3535ZG25Z4S Datasheet Preview

KA-3535ZG25Z4S Datasheet

SMD CHIP LED LAMP

No Preview Available !

Handling Precautions
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.
As a result, special handling precautions need to be observed during assembly using silicone encapsulated
LED products. Failure to comply might lead to damage and premature failure of the LED.
1. Handle the component along the side surfaces by using forceps or appropriate tools.
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
right3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or
Kingbdamage the internal circuitry.
4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks.
4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup
and avoid damage during production.
5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of
leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.
Detailed application notes are listed on our website.
http://www.kingbright.com/application_notes
SPEC NO: DSAM0801
APPROVED: WYNEC
REV NO: V.4B
CHECKED: Allen Liu
DATE: MAR/30/2013
DRAWN: F.Cui
PAGE: 2 OF 6
ERP: 1201005740


Part Number KA-3535ZG25Z4S
Description SMD CHIP LED LAMP
Maker Kingbright
Total Page 6 Pages
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