1.AC inputs. 2.High current transfer ratio. 2.Opaque type, mini-flat package. 3.Subminiature type (The volume is smaller than that of our conventional DIP type by as far .

1.Hybrid substrates that require high density mounting. 2.Programmable controllers. *PACKAGE DIMENSIONS (UNIT:mm) SMD Ty.

KB3541NT

KB3511

KB357NT

KB3063

KB3128O60

KB3301

KB3302

KB3310

KB3361

KB3386

KB3408

KB3417

KB3426