1.Opaque type,mini-flat package. 2.Subminiature type(The volume is smaller than that of our conventional DIP type by as far as 30%). 3.Isolation voltage between input and.

1.Hybrid substrates that require high density mounting. 2.Programmable controllers. *PACKAGE DIMENSIONS (UNIT:mm) SMD Ty.

KB3511

KB3541NT

KB354NT

KB3063

KB3128O60

KB3301

KB3302

KB3310

KB3361

KB3386

KB3408

KB3417

KB3426

Since 2006. D4U Semicon.   |   Contact Us   |   Privacy Policy   |   Purchase of parts