EGL341G
Features
Plastic package has underwriters laboratories flammability classification 94V-0 Glass passivated chip junction For surface mount applications High temperature metallurgically bonded construction Cavity-free glass passivated junction High temperature soldering guaranteed:450 /5 seconds at terminals.plete device sub-mersible temperature of 265 for 10 seconds in solder bath
D1 1.6± 0.1
- 213AA
SOLDERABLE ENDS
D2=D1
Đ0 Ē0.20
D2
0.5± 0.1 3.5± 0.2
0.5± 0.1
Mechanical Data
Case: JEDEC DO-213AA,molded plastic Polarity: Color band denotes cathode Weight: 0.0014 ounces, 0.036 grams Mounting position: Any
Dimensions in millimeters
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 ambient temperature unless otherwise specified.
Single phase,half wave,60 Hz,resistive or inductive load. For capacitive load,derate current by 20%.
Type Number
Maximum recurrent peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified...
