SMF3.3A Datasheet | Leiditech

Features - Glass passivated chip - 200 W peak pulse power capability with a 10/1000 us waveform, repetitive rate (duty cycle):0.01 % - Excellent clamping capability - Low reverse leakage - Very fast response time - Lead and body according with Ro HS standard 0.033 (0.85) 0.014 (0.35) Unit: inch (mm) Mechanical Data - Case: SOD123FL Molded plastic - Lead: Solderable per MIL-STD-750, method 2026 - Epoxy: UL 94V-0 rate flame retardant - Polarity: Color band denotes cathode end except Bipolar - Mounting position: Any 0.079 (2.00) 0.061 (1.55) 0 047 (1 20) 0.024 (0.60) Maximum Ratings & Characteristics Ratings at 25℃ ambient temperature unless otherwise specified. Parameter Symbols Value Unit Peak power dissipation with a 10/1000 us waveform(1) Peak pulse current wih a 10/1000 us waveform(1) Power dissipation on infinite heatsink at TL = 75 °C Peak forward surge current, 8.3 ms single half sinewave unidirectional only(2) IFSM Maximum instantaneous forward voltage at 10 A for unidirectional only Operating junction and storage temperature range TJ，TSTG -55 to +150 ℃ Note: 1)Non-repetitive current pulse per Fig.5 and derated above TA= 25 °C per Fig.1； 2)Measured on 8.3 ms single half sine-wave or equivalent square wave, duty cycle = 4 pulses per minute...