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Littelfuse

zeptoSMDC0011F Datasheet Preview

zeptoSMDC0011F Datasheet

PPTC

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POLYSWITCH®
Surface Mount > zeptoSMDC
PPTC zeptoSMDC Series
Description
Littelfuse zeptoSMDC Series PPTC is developed for
overcurrent and overtemperature protection at low-cost in
mobile application components. It works as a ‘fail-safe’ to
protect battery management ICs and fuel gauges.
Y Applications
• Mobile phone
R • Wearable device
• Lithium battery
management
Features
• Maximum electrical
rating: 13 VDC
• Short circuit current:
82~200mA
• Small footprint 0201 size
• RoHS compliant
• ISO/TS 16949 certified
Benefits
• Resettable
• Save space in PCBs due
to small footprint
A Electrical Characteristics
Part Number
IN zeptoSMDC0011F
zeptoSMDC0015F
Initial Resistance
Ohms @ 25°C
Min 1
Max
V2
MAX
(Vdc)
I3
MAX
(mA)
Trip
Temperature
°C
TYP
Hold
Current 4
(mA)
@ 25°C
10
80
13
82
125
11
10
60
13 200
125
15
Time to Trip 5
Current
(mA)
80
80
Time
(ms)
Max
20
20
Post Process
Resistance 6
ohms
@ -20°C
Min
68
ohms
@ 60°C
Max
290
28
150
Notes:
1. Rmin = Minimum resistance of device in initial (un-soldered) state
2. Vmax = Maximum voltage device can withstand without damage at rated current (Imax)
IM 3. Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax)
4. Ihold = Hold current: maximum current device will pass without tripping in 25°C still air. Values specified using PCB’s with 0.004” x 1.0 ounce copper traces
5. Time to trip values specified using PCB’s with 0.004” x 1.0 ounce copper traces
PREL 6. With LOCTITE ECCOBOND UF 3915, curing condition: 140°C/20mins, resistance is measured 12 hours post coating curing process
© 2020 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/04/20




Littelfuse

zeptoSMDC0011F Datasheet Preview

zeptoSMDC0011F Datasheet

PPTC

No Preview Available !

POLYSWITCH®
Surface Mount > zeptoSMDC
Environmental Specifications
Physical Specifications
Operating Temperature
-20°C to 60°C
Terminal Materials
Solder-Plated Copper
(Solder Material: NiAu)
Passive Aging
+85°C, 1000 hours
-25% typical resistance change
Humidity Aging
+65°C, 90% R.H.,100 hours
-/+15% typical resistance change
Y Thermal Shock
Vibration
R Moisture Sensitivity Level
MIL–STD–202, Method 107G
-33% typical resistance change
-40°C to +85°C (20 Times)
MIL–STD–202, Method 204,
Condition A No change
Level 2a, J–STD–020
Lead Solderability
Meets EIA Specification RS186-9E,
ANSI/J- STD-002B, Test S
A Soldering Parameters
Profile Feature
Pb-free assembly
Average Ramp-Up Rate (Liquidus Temp (TL)
to peak
1~3ºC/second
max.
IN Preheat
Temperature Min. (Tsmin)
Temperature Max. (Tsmax)
Time Min. to Max. (Ts)
130ºC
180ºC
90-110 seconds
Tsmax to TL Ramp-up Rate
Reflow
Temperature (TL) (Liquidus)
Time (tL)
IM PeakTemperature (TP)
Time within 3ºC of actual Peak Temperature (tP)
Ramp-Down Rate
≤2ºC/seconds max.
217ºC
60~70 seconds
240ºC
35 seconds
2~4ºC/seconds
PREL Time 25ºC to PeakTemperature (TP)
300 seconds max.
TP
TL
TS(max)
TS(min)
Ramp-up
Preheat
tS
tP
tL
Ramp-down
25
time to peak temperature
Time
• All temperature refer to topside of the package, measured on the package body surface.
• If reflow temperature exceeds the recommended profile, devices may not meet
the performance requirements.
• Recommended reflow methods:IR, vapor phase oven, hot air oven.
• Customer should validate that the solder paste amount and reflow recommendations
to meet its application
• Recommended maximum paste thickness is 0.25 mm (0.010 inch).
• Devices can be cleaned using standard industry methods and aqueous solvents.
• Devices can be reworked using the standard industry practices (avoid contact to
the device).
© 2020 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/04/20



Part Number zeptoSMDC0011F
Description PPTC
Maker Littelfuse
Total Page 3 Pages
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