MADP-017015-1314 diodes equivalent, pin diodes.
* 0603 Outline
* Surface Mount
* 15µm I-Region Length Devices
* No Wirebonds Required
* Silicon Nitride Passivation
* Polymer Scratch Protection <.
These packageless devices are suitable for usage in moderate incident power, ≤ 50dBm/C.W. or where the peak power is ≤ 7.
This device is a silicon, glass PIN diode surmount chip fabricated with M/A-COM Technology Solutions patented HMICTM process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of o.
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