MADP-030015-1314 Description
This device is a silicon, glass PIN diode surmount chip fabricated with M/A- Technology Solutions patented HMICTM process.
MADP-030015-1314 Key Features
- 0603 Outline
- Surface Mount
- 15µm I-Region Length Devices
- No Wirebonds Required
- Silicon Nitride Passivation
- Polymer Scratch Protection
- Low Parasitic Capacitance and Inductance
- High Average and Peak Power Handling