MADP-042905-13060 diodes equivalent, pin diodes.
* Surface Mount
* No Wirebonds Required
* Rugged Silicon-Glass Construction
* Silicon Nitride Passivation
* Polymer Scratch Protection
* Low.
These packageless devices are suitable for moderate incident power applications, ≤ 10W/C.W. or where the peak power is ≤.
This device is a silicon, glass PIN diode surmount chip fabricated with M/A-COM Tech’s patented HMICTM process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal an.
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