Bumped GaAs SP3T Switch for WLAN
2.4 - 2.5 GHz
• 802.11b/g and Bluetooth Applications
• Insertion Loss: 0.60 dB typical
31 dB typical (RX Path)
22 dB typical (TX / BT paths)
• Flip-chip configuration
• RoHS* Compliant
The MASW-008902-000DIE is a bumped single
band GaAs pHEMT MMIC SP3T switch. Typical
applications are for single band 2.4 GHz WLAN
(802.11 b/g) and Bluetooth applications.
The MASW-008902-000DIE delivers high isolation,
low insertion loss, and high linearity at 2.4 - 2.5 GHz.
The MASW-008902-000DIE is fabricated using a 0.5
micron gate length GaAs pHEMT process. The
process features full passivation for performance
and reliability. This die features SnAg (2.5%) solder
bumps for WLCSP applications.
Ordering Information 1,2
MASW-008902-000DIE Separated Die on Grip Ring
Die Bump Pad Layout (bump side up)
Die Bump Pad Configuration
Voltage Control 1
Blue Tooth TX/RX Port
2.5 GHz TX Port
Voltage Control 3
2.5 GHz RX Port
Voltage Control 2
Die in 3000 piece reel
Sample Board SP3T
1. Die quantity varies.
2. Die on Grip Ring not available with orientation mark.
Absolute Maximum Ratings 3,4
Input Power @ 3 V Control
Input Power @ 5 V Control
-40°C to +85°C
-65°C to +150°C
3. Exceeding any one or combination of these limits may cause
permanent damage to this device.
4. M/A-COM Technology does not recommend sustained
operation near these survivability limits.
* Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +318.104.22.16800
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.