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MASW-008902-000DIE - Bumped GaAs SP3T Switch

Download the MASW-008902-000DIE datasheet PDF (MASW-008902-000DIE-MA included). The manufacturer datasheet provides complete specifications, pinout details, electrical characteristics, and typical applications for bumped gaas sp3t switch.

Description

The MASW-008902-000DIE is a bumped single band GaAs pHEMT MMIC SP3T switch.

Typical applications are for single band 2.4 GHz WLAN (802.11 b/g) and Bluetooth applications.

The MASW-008902-000DIE delivers high isolation, low insertion loss, and high linearity at 2.4 - 2.5 GHz.

Features

  • 802.11b/g and Bluetooth.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MASW-008902-000DIE-MA-COM.pdf) that lists specifications for multiple related part numbers.

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Full PDF Text Transcription

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MASW-008902-000DIE Bumped GaAs SP3T Switch for WLAN 2.4 - 2.5 GHz Features • 802.11b/g and Bluetooth Applications • Insertion Loss: 0.60 dB typical • Isolation: 31 dB typical (RX Path) 22 dB typical (TX / BT paths) • Flip-chip configuration • RoHS* Compliant Description The MASW-008902-000DIE is a bumped single band GaAs pHEMT MMIC SP3T switch. Typical applications are for single band 2.4 GHz WLAN (802.11 b/g) and Bluetooth applications. The MASW-008902-000DIE delivers high isolation, low insertion loss, and high linearity at 2.4 - 2.5 GHz. The MASW-008902-000DIE is fabricated using a 0.5 micron gate length GaAs pHEMT process. The process features full passivation for performance and reliability. This die features SnAg (2.5%) solder bumps for WLCSP applications.
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