MASW-009276-001DIE Key Features
- 802.11b/g and Bluetooth
- Part: MASW-009276-001DIE
- Manufacturer: MACOM Technology Solutions
- Size: 281.20 KB
MASW-009276-001DIE Description
The MASW-009276-001DIE is a bumped GaAs pHEMT MMIC SP3T switch. Typical applications are WLAN (802.11 b/g) and Bluetooth applications. Die Bump Pad Layout (bump side up) The MASW-009276-001DIE delivers high isolation, low insertion loss, and high linearity at 2.4 - 2.5 GHz.