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MASW-009276-001DIE - Bumped GaAs SP3T Switch

Download the MASW-009276-001DIE datasheet PDF. This datasheet also covers the MASW-009276-001DIE-MA variant, as both devices belong to the same bumped gaas sp3t switch family and are provided as variant models within a single manufacturer datasheet.

General Description

The MASW-009276-001DIE is a bumped GaAs pHEMT MMIC SP3T switch.

Typical applications are WLAN (802.11 b/g) and Bluetooth applications.

The MASW-009276-001DIE delivers high isolation, low insertion loss, and high linearity at 2.4 - 2.5 GHz.

Key Features

  • 802.11b/g and Bluetooth.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MASW-009276-001DIE-MA-COM.pdf) that lists specifications for multiple related part numbers.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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MASW-009276-001DIE Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz Rev. V2 Features • 802.11b/g and Bluetooth Applications • Low Insertion Loss: 0.5 dB 2.4 GHz to 2.5 GHz band • High Isolation: 32 dB Typical on RX • Low Harmonics: <-70 dBc @ 20 dBm • Flip-chip configuration • RoHS* Compliant Description The MASW-009276-001DIE is a bumped GaAs pHEMT MMIC SP3T switch. Typical applications are WLAN (802.11 b/g) and Bluetooth applications. Die Bump Pad Layout (bump side up) The MASW-009276-001DIE delivers high isolation, low insertion loss, and high linearity at 2.4 - 2.5 GHz. This device is fabricated using a 0.5 micron gate length GaAs pHEMT process. The process features full passivation for performance and reliability. This die features SnAg(3.