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913R0K-BSP-3 - Binary Chip Capacitors

Download the 913R0K-BSP-3 datasheet PDF. This datasheet also covers the 911R5K-BSP-3 variant, as both devices belong to the same binary chip capacitors family and are provided as variant models within a single manufacturer datasheet.

General Description

The 91xRxK-BOO and -BSP Series binary chip capacitors are designed to facilitate bread-boarding or to use where a trimming capability is required.

These devices feature the same dielectric layer and bonding surfaces as our 9000 and 9100 Series chip capacitors.

Key Features

  • High Reliability Silicon Nitride/Oxide Dielectric.
  • Low Loss.
  • Long Term Reliability & Stability.
  • RoHS.
  • Compliant.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (911R5K-BSP-3-MACOM.pdf) that lists specifications for multiple related part numbers.

📁 Similar Datasheet

Part Number Description Manufacturer
913507 PCB Terminal Block Molex Electronics

Other Datasheets by MACOM Technology Solutions

Part Number Description
913R7K-BOO Binary Chip Capacitors
913R7K-BSP-1 Binary Chip Capacitors
913R7K-BSP-3 Binary Chip Capacitors

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
Binary Chip Capacitors Features • High Reliability Silicon Nitride/Oxide Dielectric • Low Loss • Long Term Reliability & Stability • RoHS* Compliant Description The 91xRxK-BOO and -BSP Series binary chip capacitors are designed to facilitate bread-boarding or to use where a trimming capability is required. These devices feature the same dielectric layer and bonding surfaces as our 9000 and 9100 Series chip capacitors. By connecting the pads in parallel, the capacitance values are additive, so many combinations are possible. The BSP-1 chip offers the same capacitance values as BOO and BSP-3, but in a slightly larger chip with a more accommodating layout for ease of bonding. The top contact and backside terminals are gold.