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MEMEIS

MXC6255XC Datasheet Preview

MXC6255XC Datasheet

Chip Scale Packaged Digital Thermal Orientation Sensing Accelerometer

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Powerful Sensing Solutions for a Better Life
Ultra Low Cost ACCELEROMETER
Chip Scale Packaged Digital Thermal Orientation Sensing Accelerometer
MXC6255XC
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
MXC6255XC – Ultra Low Cost Accelerometer
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its
use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property of
MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.
Rev.E(5/26/2014)
Formal release date: 5/29/2014 Page 1 of 14




MEMEIS

MXC6255XC Datasheet Preview

MXC6255XC Datasheet

Chip Scale Packaged Digital Thermal Orientation Sensing Accelerometer

No Preview Available !

Powerful Sensing Solutions for a Better Life
Ultra Low Cost ACCELEROMETER
MXC6255XC: Fully Integrated Thermal Accelerometer
Features
General Description
Fully Integrated Thermal Accelerometer
X/Y Axis, 8 bit, Acceleration A/D Output (± 2g)
Chip Scale Package (1.18x1.705x0.955mm)
4-position Orientation Detection
Shake Detection with Interrupt
Programmable Shake Threshold
Shake Direction Detection
I2C Interface
Power Down Mode
Shock Survival Greater than 50,000 g
Operating Supply Voltage from 2.5V to 5.5V with
1.8V compatible IO
Produces no Mechanical Sounds ("click")
The MEMSIC Digital Thermal Orientation Sensor is the world's first fully-integrated
orientation sensor also with chip scale package. Its operation is based on our
patented MEMS-thermal technology and is built using a standard 0.18um CMOS
process. DTOS contains no moving parts (such as a ball) and thus eliminates
field-reliability and repeatability issues associated with competitive products. It also
eliminates the "click" sounds typically heard in ball based orientation sensors. Shock
survival is greater than 50,000g. DTOS detects four orientations, shake and shake
direction. In addition, it provides X/Y axis acceleration signals with very low 0g offset.
An I2C interface is used to communicate with this device and an interrupt pin (INT) is
provided for shake and orientation. The DTOS also has a power down enabled
through the I2C interface.
Applications
Consumer:
Cell Phones
Digital Still Cameras (DSC)
Digital Video Cameras (DVC)
LCD TV
Toys
MP3, MP4 Players
Household Safety:
Fan Heaters
Halogen Lamps
Iron
Cooling Fans
Functional Block Diagram
Figure 1
The MXC6255XC is packaged in a hermetically sealed, wafer level chip scale
package (WLCSP, 1.18 mm x 1.705 mm x 0.955mm) , the product is RoHS
compatible and operates over -20~70℃ temperature range.
© 2010 MEMSIC, Inc.
One Technology Drive, Suite 325 Andover, MA 01810, USA
Tel: +1 978 738 0900 Fax: +1 978 738 0196
www.memsic.com
MXC6255XC – Ultra Low Cost Accelerometer
Information furnished by MEMSIC is believed to be accurate and reliable. However, no responsibility is assumed by MEMSIC for its
use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of MEMSIC. Information presented in this document is the property of
MEMSIC, Inc., is considered proprietary, and is not to be reproduced without the specific written permission of MEMSIC, Inc.
Rev.E(5/26/2014)
Formal release date: 5/29/2014 Page 2 of 14


Part Number MXC6255XC
Description Chip Scale Packaged Digital Thermal Orientation Sensing Accelerometer
Maker MEMEIS
Total Page 14 Pages
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