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MICRON

RC28F00AP30BF Datasheet Preview

RC28F00AP30BF Datasheet

Micron Parallel NOR Flash Embedded Memory

No Preview Available !

512Mb, 1Gb, 2Gb:
P30-65nm
Features
Micron Parallel NOR Flash Embedded
Memory (P30-65nm)
JS28F512P30BFx, JS28F512P30EFx, JS28F512P30TFx,
PC28F512P30BFx, PC28F512P30EFx, PC28F512P30TFx,
JS28F00AP30BFx, JS28F00AP30TFx, JS28F00AP30EFx,
PC28F00AP30BFx, PC28F00AP30TFx, PC28F00AP30EFx,
RC28F00AP30BFx, RC28F00AP30TFx, PC28F00BP30EFx
Features
• High performance
• Easy BGA package features
– 100ns initial access for 512Mb, 1Gb Easy BGA
– 105ns initial access for 2Gb Easy BGA
– 25ns 16-word asynchronous page read mode
– 52 MHz (Easy BGA) with zero WAIT states and
17ns clock-to-data output synchronous burst
read mode
– 4-, 8-, 16-, and continuous word options for burst
mode
• TSOP package features
– 110ns initial access for 512Mb, 1Gb TSOP
• Both Easy BGA and TSOP package features
– Buffered enhanced factory programming (BEFP)
at 2 MB/s (TYP) using a 512-word buffer
– 1.8V buffered programming at 1.46 MB/s (TYP)
using a 512-word buffer
• Architecture
– MLC: highest density at lowest cost
– Symmetrically blocked architecture (512Mb, 1Gb,
2Gb)
– Asymmetrically blocked architecture (512Mb,
1Gb); four 32KB parameter blocks: top or bottom
configuration
– 128KB main blocks
– Blank check to verify an erased block
• Voltage and power
– VCC (core) voltage: 1.7–2.0V
– VCCQ (I/O) voltage: 1.7–3.6V
– Standby current: 70µA (TYP) for 512Mb; 75µA
(TYP) for 1Gb
– 52 MHz continuous synchronous read current:
21mA (TYP), 24mA (MAX)
• 16-bit wide data bus
• Security
– One-time programmable register: 64 OTP bits,
programmed with unique information from Mi-
cron; 2112 OTP bits available for customer pro-
gramming
– Absolute write protection: VPP = VSS
– Power-transition erase/program lockout
– Individual zero-latency block locking
– Individual block lock-down
– Password access
• Software
– 25μs (TYP) program suspend
– 25μs (TYP) erase suspend
– Flash Data Integrator optimized
– Basic command set and extended function inter-
face (EFI) command set compatible
– Common flash interface
• Density and packaging
– 56-lead TSOP package (512Mb, 1Gb)
– 64-ball Easy BGA package (512Mb, 1Gb, 2Gb)
• Quality and reliability
– JESD47 compliant
– Operating temperature: –40°C to +85°C
– Minimum 100,000 ERASE cycles per block
– 65nm process technology
09005aef845667b3
p30_65nm_MLC_512Mb-1gb_2gb.pdf - Rev. D 5/17 EN
1 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.




MICRON

RC28F00AP30BF Datasheet Preview

RC28F00AP30BF Datasheet

Micron Parallel NOR Flash Embedded Memory

No Preview Available !

512Mb, 1Gb, 2Gb:
P30-65nm
Features
Discrete and MCP Part Numbering Information
Devices are shipped from the factory with memory content bits erased to 1. For available options, such as pack-
ages or for further information, contact your Micron sales representative. Part numbers can be verified at www.mi-
cron.com. Feature and specification comparison by device type is available at www.micron.com/products. Con-
tact the factory for devices not found.
Note: Not all part numbers listed here are available for ordering.
Table 1: Discrete Part Number Information
Package
Part Number Category
Product Line
Density
Product Family
Parameter Location
Lithography
Features
Category Details
JS = 56-lead TSOP, lead free
PC = 64-ball Easy BGA, lead-free
RC = 64-ball Easy BGA, leaded
28F = Micron Flash memory
512 = 512Mb
00A = 1Gb
00B = 2Gb
P30 (VCC = 1.7–2.0V; VCCQ = 1.7–3.6V)
B/T = Bottom/Top parameter
E = Symmetrical Blocks
F = 65nm
*
Note: 1. The last digit is assigned randomly to cover packaging media, features, or other specific configuration infor-
mation. Sample part number: JS28F512P30EF*
Table 2: Standard Part Numbers
Density
512Mb
1Gb
2Gb
Configuration
Bottom boot
Top boot
Uniform
Bottom boot
Top boot
Uniform
Uniform
Medium
Tray
Tape and Reel
Tray
Tape and Reel
Tray
Tape and Reel
Tray
Tape and Reel
Tray
Tape and Reel
Tray
Tape and Reel
Tray
Tape and Reel
JS
JS28F512P30BFA
JS28F512P30TFA
JS28F512P30EFA
JS28F00AP30BFA
JS28F00AP30BTFA
JS28F00AP30EFA
PC
PC28F512P30BFA
PC28F512P30BFB
PC28F512P30TFA
PC28F512P30TFB
PC28F512P30EFA
PC28F00AP30BFA
PC28F00AP30BFB
PC28F00AP30TFA
PC28F00AP30EFA
PC28F00BP30EFA
RC
RC28F00AP30BFA
RC28F00AP30TFA
09005aef845667b3
p30_65nm_MLC_512Mb-1gb_2gb.pdf - Rev. D 5/17 EN
2 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2013 Micron Technology, Inc. All rights reserved.


Part Number RC28F00AP30BF
Description Micron Parallel NOR Flash Embedded Memory
Maker MICRON
Total Page 30 Pages
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