MSM8521C-020 Overview
The MSM8512C is a 512K x 8 SRAM monolithic device available in Chip Size BGA (Ball Grid Array) package, with access times of 20ns. The device is available to mercial and industrial temperature .. The Chip Size BGA provides an ultra high density memory packaging solution.
MSM8521C-020 Key Features
- Access times of 20 ns
- 5V + 10%, (3.3V Under Development)
- mercial & Industrial temperature grades
- Chip Size BGA
- 48 pad, 1mm pad pitch, package
- Eutectic 63/67 solder ball attach
- Low Power Dissipation. Operating 1 W (max) Standby (CMOS) 66mW (max)
- pletely Static Operation
- 4 layer BT substrate with power and ground planes
- Pinout and footprint will remain the same in the event of a die shrink