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MP6529GR - Brushless DC Motor Pre-Driver

Download the MP6529GR datasheet PDF. This datasheet also covers the MP6529 variant, as both devices belong to the same brushless dc motor pre-driver family and are provided as variant models within a single manufacturer datasheet.

General Description

The MP6529 is a gate driver IC designed for three-phase, brushless DC motor driver applications; it is capable of driving three halfbridges consisting of six N-channel power MOSFETs up to 35V.

The MP6529 uses a bootstrap capacitor to generate a supply voltage for the high-side MOSFET driver.

Key Features

  • include programmable over-current protection (OCP), adjustable deadtime control, under-voltage lockout (UVLO), and thermal shutdown. The MP6529 is available in a 28-pin TSSOP (9.7mmx6.4mm) package with an exposed thermal pad and a 28-contact QFN (4mmx4mm) package with an exposed thermal pad. MP6529 5V to 35V, Three-Phase, Brushless DC Motor Pre-Driver.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MP6529-MPS.pdf) that lists specifications for multiple related part numbers.

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
The Future of Analog IC Technology DESCRIPTION The MP6529 is a gate driver IC designed for three-phase, brushless DC motor driver applications; it is capable of driving three halfbridges consisting of six N-channel power MOSFETs up to 35V. The MP6529 uses a bootstrap capacitor to generate a supply voltage for the high-side MOSFET driver. An internal trickle-charge circuit maintains a sufficient gate driver voltage at 100% duty cycle. Full protection features include programmable over-current protection (OCP), adjustable deadtime control, under-voltage lockout (UVLO), and thermal shutdown. The MP6529 is available in a 28-pin TSSOP (9.7mmx6.4mm) package with an exposed thermal pad and a 28-contact QFN (4mmx4mm) package with an exposed thermal pad.