MP6900- FAST TURN-OFF INTELLIGENT CONTROLLER
ORDERING INFORMATION
Part Number
MP6900DJ*
MP6900DS**
MP6900DQ***
Package
TSOT23-5
SOIC-8
QFN6 (3x3mm)
Top Marking
6D
MP6900DS
5D
* For Tape & Reel, add suffix –Z (e.g. MP6900DJ–Z).
For RoHS Compliant Packaging, add suffix –LF (e.g. MP6900DJ–LF–Z)
** For Tape & Reel, add suffix –Z (e.g. MP6900DS–Z).
For RoHS Compliant Packaging, add suffix –LF (e.g. MP6900DS–LF–Z)
*** For Tape & Reel, add suffix –Z (e.g. MP6900DQ–Z).
For RoHS Compliant Packaging, add suffix –LF (e.g. MP6900DQ–LF–Z)
PACKAGE REFERENCE
TOP VIEW
TOP VIEW
VG 1
VSS 2
VDD 3
5 PGND
4 VD
PGND 1
EN 2
NC 3
VD 4
8 VG
7 NC
6 VDD
5 VSS
TSOT23-5
SOIC-8
QFN6 (3x3mm)
ABSOLUTE MAXIMUM RATINGS (2)
VDD to Vss ......................................-0.3V to +27V
PGND to VSs ................................-0.3V to +0.3V
VG to VSS ......................................... -0.3V to VCC
VD to VSS .....................................-0.7V to +180V
EN to VSS .....................................-0.3V to +6.5V
Maximum Operating Frequency............. 400kHz
Continuous Power Dissipation (TA = +25°C) (3)
SOIC8 ...................................................... 1.39W
TSOT23-5 ................................................ 0.57W
QFN6 (3x3mm) .......................................... 2.5W
Junction Temperature ...............................150C
Lead Temperature (Solder).......................260C
Storage Temperature .............. -55°C to +150C
Recommended Operation Conditions (4)
VDD to Vss ............................................ 8V to 24V
Operating Junction Temp. (TJ).... -40°C to +125°C
Thermal Resistance (5) θJA θJC
SOIC8..................................... 90 ...... 45... C/W
TSOT23-5.............................. 220 .... 110.. C/W
QFN6 (3x3mm) ....................... 50 ...... 12... C/W
Notes:
2) Exceeding these ratings may damage the device.
3) The maximum allowable power dissipation is a function of the
maximum junction temperature. TJ(MAX) the junction-to-
ambient thermal resistance θJA and the ambient temperature
TA. The maximum allowable power dissipation at any ambient
temperature is calculated using: PD(MAX)=(TJ(MAX)-TA)/ θJA.
Exceeding the maximum allowable power dissipation will
cause excessive die temperature, and the regulator will go
into thermal shutdown. Internal thermal shutdown circuitry
protects the device from permanent damage.
4) The device is not guaranteed to function outside of its
operating conditions.
5) Measured on JESD51-7, 4-layer PCB.
MP6900 Rev. 1.14
www.MonolithicPower.com
2
8/23/2018
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