MP86963 –20A, 27V INTELLI-PHASETM SOLUTION INTEGRATED HS/LS FETS AND DRIVER IN A 5X5mm QFN
PATENTS PENDING – CONTROLLED DOCUMENT
Part Number*
MP86963DUT
ORDERING INFORMATION
Package
Top Marking
5x5 TQFN
86963UT
Free Air Temperature(TA)
-40C to +85C
* For Tape & Reel, add suffix –Z (e.g. MP86963DUT–Z);
For RoHS compliant packaging, add suffix –LF (e.g. MP86963DUT–LF–Z)
PACKAGE REFERENCE
ABSOLUTE MAXIMUM RATINGS (1)
Supply Voltage VIN .......................................27V
VSW(DC) ................................-0.3V to VIN +0.3V
VSW(20ns) ................................... -3V to VIN +3V
VBST .....................................................VSW + 6V
All Other Pins................................. -0.3V to +6V
Continuous Power Dissipation (TA = +25°C) (2)
............................................................ 3.8W
Junction Temperature .............................. 150C
Lead Temperature ................................... 260C
Storage Temperature............... -65C to +150C
Recommended Operating Conditions (3)
Supply Voltage VIN .......................... 4.5V to 21V
VCC Driver Voltage………………….4.5V to 5.5V
Operating Junct. Temp (TJ)...... -40C to +125C
Thermal Resistance (4) θJA θJC
5x5 TQFN .............................. 33 ....... 8.... C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ(MAX), the junction-to-
ambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-
TA)/ θJA. Exceeding the maximum allowable power dissipation
will cause excessive die temperature.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.
MP86963 Rev.1.22
www.MonolithicPower.com
2
8/19/2020
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