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Macronix International
Macronix International

MX29LA320MB Datasheet Preview

MX29LA320MB Datasheet

(MX29LA32xMx) SINGLE VOLTAGE 3V ONLY FLASH MEMORY

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MX29LA320MB pdf
MX29LA32xMT/B
FEATURES
32M-BIT [4M x 8/2M x 16] SINGLE VOLTAGE 3V
ONLY FLASH MEMORY
GENERAL FEATURES
• Single Power Supply Operation
- 2.7 to 3.6 volt for read, erase, and program opera-
tions
• 4,194,304 x 8 / 2,097,152 x 16 switchable
• Sector structure
- 8KB (4KW) x 8 and 64KB(32KW) x 63
www.DataSheet4UL.caomtch-up protected to 250mA from -1V to VCC + 1V
• Low VCC write inhibit is equal to or less than 1.5V
• Compatible with JEDEC standard
- Pin-out and software compatible to single power sup-
ply Flash
PERFORMANCE
• High Performance
- Fast access time: 70R/90ns
- Page read time: 25ns
- Sector erase time: 0.5s (typ.)
- Effective write buffer word programming time: 22us
- 4 word/8 byte page read buffer
- 16 word/ 32 byte write buffer: reduces programming
time for multiple-word/byte updates
• Low Power Consumption
- Active read current: 18mA(typ.)
- Active write current: 50mA(typ.)
- Standby current: 20uA(typ.)
• Minimum 100,000 erase/program cycle
• 20-years data retention
SOFTWARE FEATURES
• Support Common Flash Interface (CFI)
- Flash device parameters stored on the device and
provide the host system to access
• Program Suspend/Resume
- Suspend program operation to read other sectors
• Erase Suspend/Erase Resume
- Suspends sector erase operation to read data from or
program data to another sector which is not being
erased
• Status Reply
- Data# polling & Toggle bits provide detection of pro-
gram and erase operation completion
HARDWARE FEATURES
• Ready/Busy (RY/BY#) Output
- Provides a hardware method of detecting program
and erase operation completion
• Hardware Reset (RESET#) Input
- Provides a hardware method to reset the internal
state machine to read mode
• WP#/ACC input
- Write protect (WP#) function allows protection of all
sectors, regardless of sector protect status
- ACC (high voltage) accelerates programming time
for higher throughput during system
SECURITY
• Sector Protection/Chip Unprotect
- Provides sector group protect function to prevent pro-
gram or erase operation in the protected sector group
- Provides chip unprotect function to allow code
changes
• Sector Permanent Lock
- A unique lock bit feature allows the content to be
permanently locked
(Please contact Macronix sales for specific infor-
mation regarding this permanent lock feature)
• Secured Silicon Sector
- Provides a 128-word OTP area for permanent, se-
cure identification
- Can be programmed and locked at factory or by cus-
tomer
PACKAGE
• 48-pin TSOP (for MX29LA320MT/B)
• 48-ball CSP (for MX29LA320MT/B)
• 56-pin TSOP (for MX29LA321MT/B)
• 64-ball CSP (for MX29LA321MT/B)
All Pb-free devices are RoHS Compliant
GENERAL DESCRIPTION
The MX29LA32xMT/B is a 32-mega bit Flash memory
organized as 4M bytes of 8 bits or 2M words of 16 bits.
MXIC's Flash memories offer the most cost-effective and
reliable read/write non-volatile random access memory.
The MX29LA32xMT/B is packaged in 48-pin TSOP, 48-
ball CSP, 56-pin TSOP and 64-ball CSP. It is designed
to be reprogrammed and erased in system or in standard
EPROM programmers.
The standard MX29LA32xMT/B offers access time as
fast as 70ns, allowing operation of high-speed micropro-
cessors without wait states. To eliminate bus conten-
tion, the MX29LA32xMT/B has separate chip enable
(CE#) and output enable (OE#) controls.
P/N:PM1144
REV. 1.3, NOV. 15, 2005
1



Macronix International
Macronix International

MX29LA320MB Datasheet Preview

MX29LA320MB Datasheet

(MX29LA32xMx) SINGLE VOLTAGE 3V ONLY FLASH MEMORY

No Preview Available !

MX29LA320MB pdf
MX29LA32xMT/B
MXIC's Flash memories augment EPROM functionality
with in-circuit electrical erasure and programming. The
MX29LA32xMT/B uses a command register to manage
this functionality.
automatically programs the entire array prior to electrical
erase. The timing and verification of electrical erase are
controlled internally within the device.
MXIC Flash technology reliably stores memory contents
even after 100,000 erase and program cycles. The MXIC
cell is designed to optimize the erase and program
mechanisms. In addition, the combination of advanced
www.DataSheett4uUn.cnoeml oxide processing and low internal electric fields
for erase and programming operations produces reliable
cycling. The MX29LA32xMT/B uses a 2.7V to 3.6V VCC
supply to perform the High Reliability Erase and auto
Program/Erase algorithms.
The highest degree of latch-up protection is achieved
with MXIC's proprietary non-epi process. Latch-up pro-
tection is proved for stresses up to 100 milliamperes on
address and data pin from -1V to VCC + 1V.
AUTOMATIC PROGRAMMING
The MX29LA32xMT/B is byte/word/page programmable
using the Automatic Programming algorithm. The Auto-
matic Programming algorithm makes the external sys-
tem do not need to have time out sequence nor to verify
the data programmed. The typical chip programming time
at room temperature of the MX29LA32xMT/B is less than
31.5 seconds.
AUTOMATIC PROGRAMMING ALGORITHM
MXIC's Automatic Programming algorithm require the user
to only write program set-up commands (including 2 un-
lock write cycle and A0H) and a program command (pro-
gram data and address). The device automatically times
the programming pulse width, provides the program veri-
fication, and counts the number of sequences. A status
bit similar to DATA# polling and a status bit toggling be-
tween consecutive read cycles, provide feedback to the
user as to the status of the programming operation.
AUTOMATIC SECTOR ERASE
The MX29LA32xMT/B is sector(s) erasable using
MXIC's Auto Sector Erase algorithm. Sector erase modes
allow sectors of the array to be erased in one erase cycle.
The Automatic Sector Erase algorithm automatically pro-
grams the specified sector(s) prior to electrical erase.
The timing and verification of electrical erase are con-
trolled internally within the device.
AUTOMATIC ERASE ALGORITHM
MXIC's Automatic Erase algorithm requires the user to
write commands to the command register using stan-
dard microprocessor write timings. The device will auto-
matically pre-program and verify the entire array. Then
the device automatically times the erase pulse width,
provides the erase verification, and counts the number
of sequences. A status bit toggling between consecu-
tive read cycles provides feedback to the user as to the
status of the programming operation.
Register contents serve as inputs to an internal state-
machine which controls the erase and programming cir-
cuitry. During write cycles, the command register inter-
nally latches address and data needed for the program-
ming and erase operations. During a system write cycle,
addresses are latched on the falling edge, and data are
latched on the rising edge of WE# .
MXIC's Flash technology combines years of EPROM
experience to produce the highest levels of quality, reli-
ability, and cost effectiveness. The MX29LA32xMT/B
electrically erases all bits simultaneously using Fowler-
Nordheim tunneling. The bytes are programmed by us-
ing the EPROM programming mechanism of hot elec-
tron injection.
AUTOMATIC CHIP ERASE
The entire chip is bulk erased using 50 ms erase pulses
according to MXIC's Automatic Chip Erase algorithm.
Typical erasure at room temperature is accomplished in
less than 32 seconds. The Automatic Erase algorithm
During a program cycle, the state-machine will control
the program sequences and command register will not
respond to any command set. During a Sector Erase
cycle, the command register will only respond to Erase
Suspend command. After Erase Suspend is completed,
the device stays in read mode. After the state machine
has completed its task, it will allow the command regis-
ter to respond to its full command set.
P/N:PM1144
REV. 1.3, NOV. 15, 2005
2


Part Number MX29LA320MB
Description (MX29LA32xMx) SINGLE VOLTAGE 3V ONLY FLASH MEMORY
Maker Macronix International
Total Page 30 Pages
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