Datasheet Summary
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Metal Can Infrared Emitter
Features
Ultra High Power Output Chip Size 1.0x1.0mm Four Wire Bonds on Die Corners Standard 3- lead TO- 39 Hermetic Package Two Catode Pins Must Be Externally Connected Together
Maximum Ratings (Ta=25 C)
Characteristic Forward Current Pulsed Forward Current Reverse Voltage Power Dissipation Operating Temperature Storage Temperature Junction Temperature Soldering Temperature Symbol IF IFP VR PD Topr Tstg Tj Tsol Max. 500 10.00 5 1000.00
- 50 ~ +100
- 50 ~ +100 100 260 Test Condition Unit
- tw=10µ S, T=10mS
- -
- -
- for 3 sec. max mA A V mW o o
DataShee
. o o
C C C o
Opto- Electrical Characteristics (Ta=25...