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AN17820B - LOW-FREQUENCY AMPLIFIER

Datasheet Details

Part number AN17820B
Manufacturer Matsushita
File Size 1.79 MB
Description LOW-FREQUENCY AMPLIFIER
Datasheet download datasheet AN17820B Datasheet

General Description

) Chip surface passivation SiN, PSG, Others ( )1 Lead frame material Fe group, Cu group, Others ( ) 2, 6 Inner lead surface process Ag plating, Au plating, Others ( *2 Outer lead surface process Solder plating (98Sn-2Bi), Solder dip, Others ( )2 )6 *2 Chip mounting method Ag paste, Au-Si alloy, Solder (95.5Pb-2.5Ag-2Sn)** 3 Wire bonding method Thermalsonic bonding, Others ( )4 Wire material Au, Others ( )4 Mold material Epoxy, Others ( )5 Molding method Transfer mold, Multiplunger mold, Others ( )5 Fin material Cu group, Others ( )7 Package FP-12S **Under RoHS exemption clause, Lead (Pb) in high melting temperature type solder (i.e.

tin-lead solder alloys containing more than 85% of lead), is exempted until 2010.

43 1 56 72 *2 Eff.

Overview

www.DataSheet4U.com www.DataSheet4U.com www.DataSheet4U.com www.DataSheet4U.com www.DataSheet4U.com Prepared Lim Fuey Sheen Checked Kenneth Law Approved Yasuo Higuchi Product Specifications AN17820B Ref No.

Total Page Page No.

Package Name FP-12S Unit : mm E 18 6 ∅ 3.6 6.4 ± 0.3 7.7 ± 0.3 7.8 ± 0.3 www.DataSheet4U.com 29.6 ± 0.3 1 12 0.6 ± 0.1 29.96 ± 0.3 28.0 ± 0.3 20.0±0.1 R1.8 +0.1 0.25 -0.05 2.54 3.5 ± 0.3 0.6 1.2 ± 0.1 Eff.