Maxim Integrated Semiconductor Electronic Components Datasheet

MAX11154 Datasheet

SAR ADC

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MAX11154

18-Bit, 500ksps, 0 to 5V SAR ADC with

Internal Reference in TDFN

General Description

The MAX11154 18-bit, 500ksps, SAR ADC offers excellent

AC and DC performance with unipolar input range, small

size, and internal reference. The MAX11154 integrates an

optional internal reference and buffer, saving additional

cost and space.

This ADC typically achieves 93.8dB SNR and -105.8dB THD.

The device guarantees 18-bit no-missing codes and ±2

LSB INL (typ).

The MAX11154 communicates using an SPI-compatible

serial interface at 2.3V, 3V, 3.3V, or 5V logic. The serial

interface can be used to daisy-chain multiple ADCs for

multichannel applications and provides a busy indicator

option for simplified system synchronization and timing.

The MAX11154 is offered in a 12-pin, 3mm x 3mm,

TDFN package and is specified over the -40NC to +85NC

temperature range.

Applications

●● Data Acquisition Systems

●● Industrial Control Systems/Process Control

●● Medical Instrumentation

●● Automatic Test Equipment

Benefits and Features

●● High DC/AC Accuracy Improves Measurement Quality

• 18-Bit Resolution with No Missing Codes

• 500ksps Throughput Rates without Pipeline Delay/

Latency

• 93.8dB SNR and -105.8dB THD at 10kHz

• 1.7 LSBRMS Transition Noise

• ±0.6 LSB DNL (typ) and ±2 LSB INL (typ)

●● Highly Integrated ADC Saves Cost and Space

• ±7ppm/°C Internal Reference

• Internal Reference Buffer

●● Wide Supply Range and Low Power Simplify

Power-Supply Design

• 5V Analog Supply

• 2.3V to 5V Digital Supply

• 23.6mW Power Consumption with External Reference

at 500ksps

• 10µA in Shutdown Mode

●● Multi-Industry Standard Serial Interface and

Small Package Reduce Size

• SPI/QSPI™/MICROWIRE®/DSP-Compatible

Serial Interface

• 3mm x 3mm Tiny 12-Pin TDFN Package

Selector Guide and Ordering Information appear at end of

data sheet.

Typical Operating Circuit

0 to 5V

10Ω

MAX9632

4.7nF

AIN+

AIN-

REF

10µF

1µF VDD

(5V)

0.1µF

OVDD

(2.3V TO 5V)

18-BIT ADC

MAX11154

REF

BUF

INTERFACE

AND CONTROL

CONFIGURATION REGISTER

INTERNAL

REFERENCE

AGNDS

GND

SCLK

DIN

DOUT

HOST

CONTROLLER

CNVST

REFIO

0.1µF

QSPI is a trademark of Motorola, Inc.

MICROWIRE is a registered trademark of National

Semiconductor Corporation.

14-Bit to 18-Bit SAR ADC Family

14-BIT

16-BIT

16-BIT 18-BIT

500ksps 250ksps 500ksps 500ksps

±5V Input

Internal

Reference

—

MAX11167

MAX11169

0 to 5V Input

Internal

Reference

—

MAX11161

MAX11165

0 to 5V Input

External MAX11262 MAX11163

Reference

MAX11166 MAX11156

MAX11168 MAX11158

MAX11160 MAX11150

MAX11164 MAX11154

MAX11162 MAX11152

19-6722; Rev 2; 11/15

Maxim Integrated Semiconductor Electronic Components Datasheet

MAX11154 Datasheet

SAR ADC

No Preview Available !

MAX11154

18-Bit, 500ksps, 0 to 5V SAR ADC with

Internal Reference in TDFN

Absolute Maximum Ratings

VDD to GND.............................................................-0.3V to +6V

OVDD to GND........ -0.3V to the lower of (VDD + 0.3V) and +6V

AIN+ to GND............................................................-0.3V to +6V

Continuous Power Dissipation (TA = +70NC)

TDFN (derate 18.2mW/NC above +70NC)...................1349mW

Operating Temperature Range............................ -40NC to +85NC

AIN-, REF, REFIO, AGNDS

Junction Temperature.......................................................+150NC

to GND................ -0.3V to the lower of (VDD + 0.3V) and +6V

SCLK, DIN, DOUT, CNVST

Storage Temperature Range............................. -65NC to +150NC

Lead Temperature (soldering, 10s).................................. +300NC

to GND................ -0.3V to the lower of (VDD + 0.3V) and +6V

Maximum Current into Any Pin...........................................50mA

Soldering Temperature (reflow)........................................+260NC

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation

of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect device reliability.

Package Thermal Characteristics (Note 1)

TDFN

Junction-to-Ambient Thermal Resistance (qJA).......59.3NC/W

Junction-to-Case Thermal Resistance (qJC)............22.5NC/W

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

Electrical Characteristics

(VDD = 4.75V to 5.25V, VOVDD = 2.3V to 5.25V, fSAMPLE = 500ksps, Reference Mode 3, VREF = 4.096V; TA = TMIN to TMAX, unless

otherwise noted. Typical values are at TA = +25NC.) (Note 2)

PARAMETER

ANALOG INPUT (Note 3)

Input Voltage Range

SYMBOL

CONDITIONS

AIN+ to AIN-, K = 5.0/4.096

Absolute Input Voltage Range

Input Leakage Current

Input Capacitance

Input-Clamp Protection Current

STATIC PERFORMANCE (Note 4)

Resolution

No Missing Codes

Offset Error

Offset Error Temperature

Coefficient

Gain Error

Gain Error Temperature

Coefficient

Integral Nonlinearity

Differential Nonlinearity

Positive Full-Scale Error

Analog Input CMRR

INL

DNL

CMRR

AIN+ to GND

AIN- to GND

Acquisition phase

Both inputs

Guaranteed by design

MIN TYP MAX UNITS

+K x

VREF

-0.1

+(VDD +

0.1)

-0.1 +0.1

-10 +0.001 +10

-20 +20

µA

-15.5

±1.45

+15.5

Bits

LSB

±0.01

LSB/°C

-15 ±4.3 +15

LSB

±0.016

LSB/°C

-6 ±2 +6 LSB

-1 ±0.6 +1

LSB

-22 +22 LSB

-7.86

LSB/V

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MAX11154 Datasheet

SAR ADC

MAX11154 Datasheet

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