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Maxim Integrated Semiconductor Electronic Components Datasheet

MAX11165 Datasheet

SAR ADC

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EVALUATION KIT AVAILABLE
MAX11165
16-Bit, 250ksps, 0 to 5V SAR ADC with
Internal Reference in TDFN
General Description
The MAX11165 16-bit, 250ksps, SAR ADC offers
excellent AC and DC performance with unipolar input
range, small size, and internal reference. The MAX11165
integrates an optional internal reference and buffer,
saving additional cost and space.
This ADC achieves 92.4dB SNR and -104.2dB THD.
The MAX11165 guarantees 16-bit no-missing codes and
±0.6 LSB INL (typ).
The MAX11165 communicates using an SPI-compatible
serial interface at 2.3V, 3V, 3.3V, or 5V logic. The serial
interface can be used to daisy-chain multiple ADCs for
multichannel applications and provides a busy indicator
option for simplified system synchronization and timing.
The MAX11165 is offered in a 12-pin, 3mm x 3mm, TDFN
package and is specified over the -40NC to +85NC
temperature range.
Applications
● Data Acquisition Systems
● Industrial Control Systems/Process Control
● Medical Instrumentation
● Automatic Test Equipment
Selector Guide and Ordering Information appear at end of
data sheet.
Benefits and Features
● High DC/AC Accuracy Improves Measurement
Quality
• 16-Bit Resolution with No Missing Codes
• 250ksps Throughput Rates Without Pipeline Delay/
Latency
• 92.4dB SNR and -104.2dB THD at 10kHz
• 0.5 LSBRMS Input-Referred Noise
• ±0.2 LSB DNL (typ) and ±0.6 LSB INL (typ)
● Highly Integrated ADC Saves Cost and Space
• ±6ppm/°C Internal Reference
• Internal Reference Buffer
● Wide Supply Range and Low Power Simplify Power-
Supply Design
• 5V Analog Supply
• 2.3V to 5V Digital Supply
• 19mW Power Consumption at 250ksps
10μA in Shutdown Mode
● Multi-Industry Standard Serial Interface and Small
Package Reduce Size
• SPI/QSPI/MICROWIRE®/DSP-Compatible Serial
Interface
• 3mm x 3mm Tiny 12-Pin TDFN Package
QSPI is a trademark of Motorola, Inc.
MICROWIRE is a registered trademark of National
Semiconductor Corporation.
Typical Operating Circuit
0 to +5V
1µF VDD
(5V)
1µF OVDD
(2.3V TO 5V)
10
MAX9632
4.7nF
C0G
Ceramic
AIN+
AIN-
REF
10µF
16-BIT ADC
MAX11165
REF
BUF
AGNDS
INTERFACE
AND CONTROL
CONFIGURATION
REGISTER
SCLK
DIN
DOUT
CNVST
HOST
CONTROLLER
INTERNAL
REFERENCE
REFIO
GND 0.1µF
14-Bit to 18-Bit SAR ADC Family
14-BIT 16-BIT
16-BIT 18-BIT
500ksps 250ksps 500ksps 500ksps
±5V Input
Internal
Reference
0 to 5V Input
Internal
Reference
MAX11167 MAX11166 MAX11156
MAX11169 MAX11168 MAX11158
MAX11161 MAX11160 MAX11150
MAX11165 MAX11164 MAX11154
0 to 5V Input
External MAX11262 MAX11163 MAX11162 MAX11152
Reference
19-6724; Rev 3; 11/15


Maxim Integrated Semiconductor Electronic Components Datasheet

MAX11165 Datasheet

SAR ADC

No Preview Available !

MAX11165
16-Bit, 250ksps, 0 to 5V SAR ADC with
Internal Reference in TDFN
Absolute Maximum Ratings
VDD to GND.............................................................-0.3V to +6V
OVDD to GND........ -0.3V to the lower of (VDD + 0.3V) and +6V
AIN+ to GND............................................................-0.3V to +6V
AIN-, REF, REFIO, AGNDS
to GND................ -0.3V to the lower of (VDD + 0.3V) and +6V
SCLK, DIN, DOUT, CNVST
to GND................ -0.3V to the lower of (VDD + 0.3V) and +6V
Maximum Current into Any Pin...........................................50mA
Continuous Power Dissipation (TA = +70NC)
TDFN (derate 18.2mW/NC above +70NC)...................1349mW
Operating Temperature Range............................ -40NC to +85NC
Junction Temperature.......................................................+150NC
Storage Temperature Range............................. -65NC to +150NC
Lead Temperature (soldering, 10s).................................. +300NC
Soldering Temperature (reflow)........................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Package Thermal Characteristics (Note 1)
TDFN
Junction-to-Ambient Thermal Resistance (qJA).......59.3NC/W
Junction-to-Case Thermal Resistance (qJC)............22.5NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(VDD = 4.75V to 5.25V, VOVDD = 2.3V to 5.25V, fSAMPLE = 250ksps, Reference Mode 3, VREF = 4.096V; TA = TMIN to TMAX, unless
otherwise noted. Typical values are at TA = +25NC.) (Note 2)
PARAMETER
ANALOG INPUT (Note 3)
Input Voltage Range
SYMBOL
CONDITIONS
5.000
AIN+ to AIN-, K = 4.096
MIN TYP MAX UNITS
0
+K x
VREF
V
Absolute Input Voltage Range
AIN+ to GND
AIN- to GND
-0.1
+(VDD
+ 0.1)
V
-0.1 +0.1
Input Leakage Current
Acquisition phase
-10 +0.001 +10
µA
Input Capacitance
32 pF
Input-Clamp Protection Current
Both inputs
-20 +20 mA
STATIC PERFORMANCE (Note 4)
Resolution
N
16 Bits
No Missing Codes
16 Bits
Offset Error
Offset Error Temperature
Coefficient
Gain Error
-4.0 ±1.0 +4.0
LSB
±0.006
LSB/°C
-3
±1.2 +3.0
LSB
Gain Error Temperature
Coefficient
±0.004
LSB/°C
Integral Nonlinearity
INL
-1.4 ±0.6 +1.4
LSB
Differential Nonlinearity
DNL Guaranteed by design
-0.5 ±0.2 +0.5
LSB
Positive Full-Scale Error
Analog Input CMRR
CMRR
-5.5
+5.5
LSB
-1.96
LSB/V
www.maximintegrated.com
Maxim Integrated 2


Part Number MAX11165
Description SAR ADC
Maker Maxim Integrated
Total Page 28 Pages
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