Maxim Integrated Semiconductor Electronic Components Datasheet

MAX5719 Datasheet

16 and 20-Bit Voltage DACs

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MAX5717/MAX5719

EVALUATION KIT AVAILABLE

16 and 20-Bit Voltage DACs

General Description

The MAX5717 and MAX5719 are serial-input, unbuffered

16 and 20-bit voltage-output unipolar digital-to-analog

converters (DACs) with integrated feedback resistors

that allow bipolar operation when used with an external

operational amplifier. These DACs provide low glitch

energy, low noise, tight bipolar resistor matching, and high

accuracy. The DACs feature ±4LSB INL (max, 16-bit) over

the temperature range of -40°C to +105°C. Integrated

precision setting resistors make the DACs easy to use.

The MAX5717 and MAX5719 feature a 50MHz, 3-wire

SPI™, QSPI™, MICROWIRE™, and DSP-compatible

serial interface.

On power-up, the output resets to zero-scale, providing

additional safety for applications which drive valves or

other transducers that need to be off on power-up. The

DAC output settles in 750ns and has a low offset and

gain drift of ±0.1 ppm/°C of FSR.

The MAX5717 is functionally similar to the MAX542,

but with significantly faster settling time. The MAX5719

provides a similar speed improvement as well as an

increase in resolution to 20 bits.

Applications

●● Test and Measurement Equipment

●● Automatic Test Equipment

●● Gain and Offset Adjustment

●● Data-Acquisition Systems

●● Process Control and Servo Loops

●● Portable Instrumentation

●● Programmable Voltage and Current sources

●● Automatic Tuning

●● Communication Systems

Benefits and Features

●● 16 and 20-bit resolution

●● ±4 LSB INL (Max, 16-bit)

●● ±0.5 LSB DNL (Max, 16-bit)

●● 750ns settling time (typ)

●● 0.05 nV-sec glitch energy

●● 6 nv/√Hz Output Noise Density

●● Integrated ±0.025% (max) Bipolar Setting Resistors

●● 4.5V to 5.5V Supply Range

●● 4.0V to VDD Reference Input Range

●● Safe Power-Up Reset-to-Zero-Scale DAC Output

(Unipolar)

●● 50MHz 3-Wire SPI Interface

●● -40°C to +105°C Operating Temperature Range.

●● SO-14 Package

Simplified Block Diagram

REFF

REFS

VDD

MAX5717/

MAX5719

RINV

RFB

16-/20-BIT DAC

LDAC

SCLK

DIN

CONTROL

LOGIC

16-/20-BIT DATA LATCH

SERIAL INPUT REGISTER

DGND

RFB

INV

OUT

AGNDF

AGNDS

Ordering Information appears at end of data sheet.

19-8567; Rev 0; 6/16

Maxim Integrated Semiconductor Electronic Components Datasheet

MAX5719 Datasheet

16 and 20-Bit Voltage DACs

No Preview Available !

MAX5717/MAX5719

16 and 20-Bit Voltage DACs

Absolute Maximum Ratings

VDD to DGND...........................................................-0.3V to +6V

CS, SCLK, DIN, LDAC

to DGND........................ -0.3V to Lesser of VDD + 0.3 and 6V

REFF, REFS to AGND.........-0.3V to Lesser of VDD+0.3 and 6V

AGNDF, AGNDS to DGND....................................-0.3V to +0.3V

OUT, INV, to AGND,

DGND...............................-0.3V to Lesser of VDD+0.3 and 6V

RFB to AGND, DGND.................................................-6V to +6V

Maximum Current into Any Pin..................... -100mA to +100mA

Continuous Power Dissipation

(TA = +70°C, derate 8.33mW/°C above +70°C.)..........667mW

Operating Temperature Range.......................... -40°C to +105°C

Junction Temperature.......................................................+150°C

Storage Temperature Range............................. -65°C to +150°C

Lead Temperature (soldering, 10s).................................... 300°C

Soldering Temperature (reflow)........................................ +260°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics (Note 1)

Thermal Resistance, Single-Layer Board

Junction-to-Ambient (θJA)..........................................120°C/W

Junction-to-Case Thermal Resistance (θJC)................37°C/W

Thermal Resistance, Four-Layer Board

Junction-to-Ambient (θJA)............................................84°C/W

Junction-to-Case Thermal Resistance (θJC)................34°C/W

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-

tutorial.

Electrical Characteristics

(VDD = 4.5V to 5.5V, AGND, DGND, AGNDF, AGNDS = 0V, VREF = VREFF = VREFS = 4.096V, LDAC = 0V, CL=10pF, RL= No Load,

TA = -40°C to +105°C, unless otherwise noted. Typical values are at TA = 25°C and VDD = 5V.)

PARAMETER

SYMBOL

STATIC PERFORMANCE - ANALOG

Resolution

Integral Nonlinearity

INL

CONDITIONS

MAX5717

MAX5719

MAX5717. Measured by a line passing

through DIN = 0 and (216 – 1).

MAX5719. Measured by a line passing

through DIN = 0 and (220 – 1).

Differential Nonlinearity

DNL

MAX5717

MAX5719

Zero-Code Offset Error

Zero-Code Temperature

Coefficient

Gain Error

Code = 0, MAX5717

Code = 0, MAX5719

Code = full scale

MIN

TYP

MAX UNITS

-4

-64.0

-0.5

-2.0

-2

-32

-0.003

±0.25

±1

±0.125

±1

±0.125

±2

±0.2

Bits

+64.0

+0.5

+2.0

+32

LSB

(16-bit)

LSB

(20-bit)

LSB

(16-bit)

LSB

(20-bit)

LSB

(16-bit)

LSB

(20-bit)

µV/°C

+0.003

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MAX5719 Datasheet

16 and 20-Bit Voltage DACs

MAX5719 Datasheet

16 and 20-Bit Voltage DACs

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