MAX5717/MAX5719
16 and 20-Bit Voltage DACs
Absolute Maximum Ratings
VDD to DGND...........................................................-0.3V to +6V
CS, SCLK, DIN, LDAC
to DGND........................ -0.3V to Lesser of VDD + 0.3 and 6V
REFF, REFS to AGND.........-0.3V to Lesser of VDD+0.3 and 6V
AGNDF, AGNDS to DGND....................................-0.3V to +0.3V
OUT, INV, to AGND,
DGND...............................-0.3V to Lesser of VDD+0.3 and 6V
RFB to AGND, DGND.................................................-6V to +6V
Maximum Current into Any Pin..................... -100mA to +100mA
Continuous Power Dissipation
(TA = +70°C, derate 8.33mW/°C above +70°C.)..........667mW
Operating Temperature Range.......................... -40°C to +105°C
Junction Temperature.......................................................+150°C
Storage Temperature Range............................. -65°C to +150°C
Lead Temperature (soldering, 10s).................................... 300°C
Soldering Temperature (reflow)........................................ +260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics (Note 1)
Thermal Resistance, Single-Layer Board
Junction-to-Ambient (θJA)..........................................120°C/W
Junction-to-Case Thermal Resistance (θJC)................37°C/W
Thermal Resistance, Four-Layer Board
Junction-to-Ambient (θJA)............................................84°C/W
Junction-to-Case Thermal Resistance (θJC)................34°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-
tutorial.
Electrical Characteristics
(VDD = 4.5V to 5.5V, AGND, DGND, AGNDF, AGNDS = 0V, VREF = VREFF = VREFS = 4.096V, LDAC = 0V, CL=10pF, RL= No Load,
TA = -40°C to +105°C, unless otherwise noted. Typical values are at TA = 25°C and VDD = 5V.)
PARAMETER
SYMBOL
STATIC PERFORMANCE – ANALOG
Resolution
N
Integral Nonlinearity
INL
CONDITIONS
MAX5717
MAX5719
MAX5717. Measured by a line passing
through DIN = 0 and (216 – 1).
MAX5717A. Measured by a line passing
through DIN = 0 and (216 - 1).
MAX5719. Measured by a line passing
through DIN = 0 and (220 – 1).
MAX5719A. Measured by a line passing
through DIN = 0 and (220 - 1).
Differential Nonlinearity
DNL
MAX5717
MAX5719
Zero-Code Offset Error
Zero-Code Temperature
Coefficient
Gain Error
Code = 0, MAX5717
Code = 0, MAX5719
Code = full scale
MIN
TYP
MAX UNITS
16
20
-4
-1
-64.0
-20
-0.5
-2.0
-2
-32
-0.003
±0.25
±0.25
±1
±1
±0.125
±1
±0.125
±2
±0.2
Bits
+4
+1
+64.0
+20
+0.5
+2.0
+2
+32
LSB
(16-bit)
LSB
(16-bit)
LSB
(20-bit)
LSB
(20-bit)
LSB
(16-bit)
LSB
(20-bit)
LSB
(16-bit)
LSB
(20-bit)
µV/°C
+0.003
%
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