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Maxim Integrated Semiconductor Electronic Components Datasheet

MAX5986C Datasheet

IEEE 802.3af-Compliant High-Efficiency PDs

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MAX5986A–MAX5986C/
MAX5987A
EVALUATION KIT AVAILABLE
IEEE 802.3af-Compliant, High-Efficiency,
Class 1/Class 2, PDs with Integrated
DC-DC Converter
General Description
The MAX5986A–MAX5986C/MAX5987A provide a
complete power-supply solution as IEEE® 802.3af-
compliant Class 1/Class 2 Powered Devices (PDs) in a
Power-over-Ethernet (PoE) system. The devices integrate
the PD interface with an efficient DC-DC converter, offering
a low external part count PD solution. The MAX5987A
includes a low-dropout regulator and the MAX5986A–
MAX5986C include sleep and ultra-low power modes.
The PD interface provides a detection signature and
a Class 1/Class 2 classification signature with a single
external resistor. The PD interface also provides an
isolation power MOSFET, a 60mA (max) inrush current
limit, and a 323mA operating current limit.
The integrated step-down DC-DC converter uses a peak
current-mode control scheme and provides an easy-to-
implement architecture with a fast transient response.
The step-down converter operates in a wide input voltage
range from 8.7V to 60V and supports up to 6.49W
of input power. The MAX5986A/MAX5986B/MAX5987A
operate at a fixed 215kHz switching frequency and
the MAX5986C operates at a fixed 430kHz switching
frequency. The DC-DC converter operates at a fixed
switching frequency, with an efficiency-boosting
frequency foldback that reduces the switching frequency
by half at light loads.
The devices feature an input undervoltage-lockout
(UVLO) with wide hysteresis and long deglitch time
to compensate for twisted-pair cable resistive drop
and to assure glitch-free transition during power-on/off
conditions. The devices also feature overtemperature
shutdown, short-circuit protection, output overvoltage
protection, and hiccup current limit for enhanced perfor-
mance and reliability.
The MAX5986A–MAX5986C/MAX5987A are available
in a 16-pin, 5mm x 5mm, TQFN power package and
operate over the -40°C to +85°C temperature range.
Ordering Information appears at end of data sheet.
IEEE is a registered service mark of the Institute of Electrical
and Electronics Engineers, Inc.
WiMAX is a registered certification mark and registered service
mark of WiMAX Forum.
Benefits and Features
● High Integration Saves Space and BOM Cost
Efficient, Integrated DC-DC Converter (with
Integrated Switches)
Built-In Output-Voltage Monitoring
Protects Against Overload, Output Short Circuit,
Output Overvoltage, and Overtemperature
Integrated TVS Diode Withstands Cable
Discharge Event (CDE)
Internal LDO Regulator with Up to 100mA Load
(MAX5987A)
IEEE 802.3af-Compliant Features Reduce Design Time
PoE Class 1/Class 2 Classification Set with
Single Resistor
Intelligent Maintain Power Signature (MPS)
Complies with IEEE 802.3af Specification
Simplified Wall Adapter Interface
Pass 2kV, 200m CAT-6 Cable Discharge Event
High Efficiency During Light Loads Reduces Power
Consumption
Sleep and Ultra-Low-Power Mode (MAX5986A/
MAX5986B/MAX5986C)
Frequency Foldback for High-Efficiency Light-Load
Operation
Back-Bias Capability to Optimize the Efficiency
Robust Performance
8.7V to 60V Wide Input Voltage Range
Hiccup-Mode Runaway Current Limit
49mA (typ) Inrush Current Limit
Open-Drain RESET Output (MAX5987A)
Flexible and Easy to Design With
3.0V to 14V Programmable Output Voltage Range
Internal Compensation
Fixed 215kHz/430kHz Switching Frequency
Fixed 3.3V or Adjustable Output Voltage through
an External Resistive Divider
Applications
IEEE 802.3af-Powered Devices
● IP Phones
Wireless Access Nodes
IP Security Cameras
WiMAX® Base Stations
19-6261; Rev 7; 11/18


Maxim Integrated Semiconductor Electronic Components Datasheet

MAX5986C Datasheet

IEEE 802.3af-Compliant High-Efficiency PDs

No Preview Available !

MAX5986A–MAX5986C/
MAX5987A
IEEE 802.3af-Compliant, High-Efficiency,
Class 1/Class 2, PDs with Integrated
DC-DC Converter
Absolute Maximum Ratings
(All voltages referenced to GND, unless otherwise noted.)
VDD to GND............................................................-0.3V to +70V
(100V, 100ms, RTEST = 3.3kω) (Note 1)
VCC, WAD, RREF to GND......................... -0.3V to (VDD + 0.3V)
AUX, LDO_IN, LED to GND..................................... -0.3V to 16V
LDO_OUT to GND............................... -0.3V to (LDO_IN + 0.3V)
LDO_FB to GND.......................................................-0.3V to +6V
LX to GND................................................. -0.3V to (VCC + 0.3V)
LDO_OUT, VDRV, FB, RESET, WK, SL, ULP,
MPS, CLASS2 to GND..........................................-0.3V to +6V
VDRV to VDD.............................................. -0.3V to (VDD + 0.3V)
PGND to GND.......................................................-0.3V to +0.3V
LX Total RMS Current............................................................1.6A
Continuous Power Dissipation (TA = + 70NC)
TQFN (derate 28.6mW/NC above +70NC)...............2285.7mW
Operating Temperature Range........................... -40NC to +85NC
Junction Temperature......................................................+150NC
Storage Temperature Range............................. -65NC to +150NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
Note 1: See Figure 1, Test Circuit.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Package Thermal Characteristics (Note 2)
Junction-to-Ambient Thermal Resistance (qJA)...............35°C/W
Junction-to-Case Thermal Resistance (qJC)...................2.7°C/W
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-lay-
er board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(VDD = 48V, RSIG = 24.9kω, LED, VCC, SL, ULP, WK, RESET, LDO_OUT unconnected, WAD = LDO_EN = LDO_IN = PGND = GND,
C1 = 68nF, C2 = 10µF, C3 = 1µF (see Figure 3), VFB = VAUX = 0V, LX unconnected. VCLASS2 = 0V, VMPS = 0V. All voltages are
referenced to GND, unless otherwise noted. TA = TJ = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.)
(Note 3)
PARAMETER
SYMBOL
CONDITIONS
POWER DEVICE (PD) INTERFACE
DETECTION MODE
Input Offset Current
Effective Differential Input
Resistance
IOFFSET
dR
VVDD = 1.4V to 10.1V (Note 4)
VVDD = 1.4V to 10.1V with 1V step,
(Note 5)
CLASSIFICATION MODE
Classification Enable Threshold
Classification Disable Threshold
Classification Stability Time
VTH,CLS,EN VDD rising
VTH,CLS,DIS VDD rising
Classification Current
POWER MODE
ICLASS
VDD = 12.6V
to 20V
CLASS2 = GND
CLASS2 = VDRV
VDD Supply Voltage Range
VDD Supply Current
VDD
IDD
VDD = 60V
MAX5986A/B/
MAX5987A
MAX5986C
MIN TYP MAX UNITS
23.95
10
25.5
FA
kI
10.2 11.5 12.5
V
22
23 23.8
V
2 ms
9.12 10.5 11.88
mA
16.1 18 20.9
60
3.6 4.5
4.8 6.6
V
mA
www.maximintegrated.com
Maxim Integrated │2


Part Number MAX5986C
Description IEEE 802.3af-Compliant High-Efficiency PDs
Maker Maxim Integrated
PDF Download

MAX5986C Datasheet PDF






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