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Maxim Integrated Semiconductor Electronic Components Datasheet

MAX17000A Datasheet

Complete DDR2 and DDR3 Memory Power-Management Solution

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MAX17000A pdf
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
General Description
The MAX17000A pulse-width modulation (PWM) con-
troller provides a complete power solution for notebook
DDR, DDR2, and DDR3 memory. It comprises a step-
down controller, a source-sink LDO regulator, and a ref-
erence buffer to generate the required VDDQ, VTT, and
VTTR rails.
The VDDQ rail is supplied by a step-down converter
using Maxim’s proprietary Quick-PWM™ controller. The
high-efficiency, constant-on-time PWM controller han-
dles wide input/output voltage ratios (low duty-cycle
applications) with ease and provides 100ns response
to load transients while maintaining a relatively constant
switching frequency. The Quick-PWM architecture cir-
cumvents the poor load-transient timing problems of
fixed-frequency current-mode PWMs while also avoid-
ing the problems caused by widely varying switching
frequencies in conventional constant-on-time and con-
stant-off-time PWM schemes. The controller senses the
current to achieve an accurate valley current-limit pro-
tection. It is also built in with overvoltage, undervoltage,
and thermal protections. The MAX17000A can be set to
run in three different modes: power-efficient SKIP
mode, low-noise forced-PWM mode, and standby
mode to support memory in notebook computer stand-
by operation. The switching frequency is programma-
ble from 200kHz to 600kHz to allow small components
and high efficiency. The VDDQ output voltage can be
set to a preset 1.8V or 1.5V, or be adjusted from 1.0V to
2.5V by an external resistor-divider. This output has 1%
accuracy over line-and-load operating range.
The MAX17000A includes a ±2A source-sink LDO reg-
ulator for the memory termination VTT rail. This VTT reg-
ulator has a ±5mV deadband that either sources or
sinks, ideal for the fast-changing load burst present in
memory termination applications. This feature also
reduces output capacitance requirements.
The VTTR reference buffer sources and sinks ±3mA,
providing the reference voltage needed by the memory
controller and devices on the memory bus.
The MAX17000A is available in a 24-pin, 4mm x 4mm,
thin QFN package.
Applications
Notebook Computers
DDR, DDR2, and DDR3 Memory Supplies
SSTL Memory Supplies
Quick-PWM is a trademark of Maxim Integrated Products, Inc.
Features
o SMPS Regulator (VDDQ)
Quick-PWM with 100ns Load-Step Response
Output Voltages—Preset 1.8V, 1.5V, or
Adjustable 1.0V to 2.5V
1% VOUT Accuracy Over Line and Load
26V Maximum Input Voltage Rating
Accurate Valley Current-Limit Protection
200kHz to 600kHz Switching Frequency
o Source/Sink Linear Regulator (VTT)
±2A Peak Source/Sink
Low-Output Capacitance Requirement
Output Voltages-Preset VDDQ/2 or REFIN
Adjustable from 0.5V to 1.5V
o Soft-Start/Soft-Shutdown
o SMPS Power-Good Window Comparator
o VTT Power-Good Window Comparator
o Selectable Overvoltage Protection
o Undervoltage/Thermal Protections
o ±3mA Reference Buffer (VTTR)
Ordering Information
PART
TEMP RANGE
PIN-PACKAGE
MAX17000AETG+ -40°C to +85°C 24 Thin QFN-EP*
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
Pin Configuration
TOP VIEW
18 17 16 15 14 13
VDD 19
12 CSL
PGND1 20
11 FB
AGND 21
SKIP 22
MAX17000A
10 REFIN
9 VTTI
VCC 23
*EP 8 VTT
SHDN 24
7 PGND2
12 3 4 56
*EXPOSED PAD
THIN QFN
4mm x 4mm
For pricing, delivery, and ordering information, please contact Maxim Direct
at 1-888-629-4642, or visit Maxim’s website at www.maximintegrated.com.
19-4307; Rev 3; 4/13


Maxim Integrated Semiconductor Electronic Components Datasheet

MAX17000A Datasheet

Complete DDR2 and DDR3 Memory Power-Management Solution

No Preview Available !

MAX17000A pdf
MAX17000A
Complete DDR2 and DDR3 Memory
Power-Management Solution
ABSOLUTE MAXIMUM RATINGS
TON to PGND1 .......................................................-0.3V to +28V
VDD to PGND1..........................................................-0.3V to +6V
VCC to VDD ............................................................-0.3V to +0.3V
OVP to AGND ...........................................................-0.3V to +6V
SHDN, STDBY, SKIP to AGND .................................-0.3V to +6V
REFIN, FB, PGOOD1,
PGOOD2 to AGND ................................-0.3V to (VCC + 0.3V)
CSH, CSL to AGND ....................................-0.3V to (VCC + 0.3V)
DL to PGND1..............................................-0.3V to (VDD + 0.3V)
BST to PGND1...........................................................-1V to +34V
BST to LX..................................................................-0.3V to +6V
DH to LX ....................................................-0.3V to (VBST + 0.3V)
BST to VDD .............................................................-0.3V to +28V
VTTI to PGND2 .........................................................-0.3V to +6V
VTT to PGND2 ............................................-0.3V to (VTTI + 0.3V)
VTTS to AGND............................................-0.3V to (VCC + 0.3V)
VTTR to AGND ..........................................-0.3V to (VCSL + 0.3V)
PGND1, PGND2 to AGND.....................................-0.3V to +0.3V
Continuous Power Dissipation (TA = +70°C)
24-Pin, 4mm x 4mm Thin QFN
(derated 27.8mW/°C above +70°C) ..........................2222mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VIN = 12V, VCC = VDD = VSHDN = VREFIN = 5V, VCSL = 1.8V, STDBY = SKIP = AGND, TA = 0°C to +85°C, unless otherwise noted.
Typical values are at TA = +25°C.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
PWM CONTROLLER
Input Voltage Range
Output-Voltage Accuracy
VIN
VCC, VDD
VCSL
VIN = 4.5V to 26V,
SKIP = VCC
FB = AGND
FB = VCC
FB = Adj
3
4.5
1.485
1.782
0.99
1.500
1.800
1.000
26
5.5
1.515
1.818
1.01
V
V
Output-Voltage Range
Load Regulation Error
Line Regulation Error
Soft-Start Ramp Time
Soft-Stop Ramp Time
Soft-Stop Threshold
VCSL
tSSTART
tSSTOP
VCSH - VCSL = 0 to 18mV, SKIP = VCC
VDD = 4.5V to 5.5V, VIN = 4.5V to 26V
Rising edge of SHDN
Falling edge of SHDN
1 2.7 V
0.1 %
0.25 %
1.4 2.1
ms
2.8 ms
25 mV
RTON = 96.75k (600kHz), -15
167ns nominal
+15
On-Time Accuracy (Note 2)
tON
VIN = 12V,
VCSL = 1.2V
RTON = 200k (300kHz),
333ns nominal
-10
+10 %
RTON = 303.25k
(200kHz), 500ns nominal
-15
+15
2 Maxim Integrated


Part Number MAX17000A
Description Complete DDR2 and DDR3 Memory Power-Management Solution
Maker Maxim Integrated Products
Total Page 30 Pages
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