802.11 b/g/n wi-fi-chip.
...... 4 1.3 Applications 5 1.4 Block Diagram ...... 5 2 Product Descriptions ..... 6 2.1 Pin Layout ... 6 2.2 PIN Description ..... 7 2.3 Strapping option ..... 9 2.4 P.
5 1.4 Block Diagram ...... 5 2 Product Descriptions ..... 6 2.1 Pin Layout ... 6 2.2 PIN Description ..... 7 2.3 Strapp.
First formal release 1. Change the thickness of the package to 0.8mm. 2. Update power consumption information Update bootstrap infomation Update thermal information 1. Fix pin order 2. Update POD 1. Correct pin description typo 2. Correct strapping o.
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