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MMI30x - Diodes & Rectifiers

Download the MMI30x datasheet PDF. This datasheet also covers the MMI300 variant, as both devices belong to the same diodes & rectifiers family and are provided as variant models within a single manufacturer datasheet.

General Description

The MicroMetrics MMI 300 series of Spiral Inductors are formed by photolithography and plating techniques on quartz substrates.

They eliminate the need for hand forming and ”staking“ of coil in hybrid circuits.

They provide uniformity, durability and repeatability in circuit fabrication.

Key Features

  • No Need for ”Staking“ Coil.
  • Passivated Protective Coating Over Coil.
  • Dimensional Uniformity.
  • Planar Solid Structure Coil Packaging.
  • Chip Chip Outline INSIDE.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MMI300_MicroMetrics.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number MMI30x
Manufacturer MicroMetrics
File Size 175.05 KB
Description Diodes & Rectifiers
Datasheet download datasheet MMI30x Datasheet

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Other Datasheets by MicroMetrics

Part Number Description
MMI300 Diodes & Rectifiers

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
www.DataSheet4U.com Passive Components: MMI 300 Series Passive Components Spiral Inductors Description The MicroMetrics MMI 300 series of Spiral Inductors are formed by photolithography and plating techniques on quartz substrates. They eliminate the need for hand forming and ”staking“ of coil in hybrid circuits. They provide uniformity, durability and repeatability in circuit fabrication. The coils are polyimide coated to protect from ambient contaminants, and to eliminate the need for conformal coating. Quartz substrates are rugged and reduce dielectric losses. Chips may be bonded using either conductive or non conductive epoxies, and wire bonded with gold wire or ribbon by thermocompression bonding.