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AN830
RFID Tag and COB Development Guide with Microchip’s RFID Devices
Author: Youbok Lee, Ph.D. Microchip Technology Inc. Since the direct die att achment reduces a step for making the COB package, it is widely used for low cost and high volume applications such as smart labels. The direct die att achment can be achieved with two dif ferent methods: (a) wire bonding or (b) flip-chip with bumped die. For the flip-chip, it needs a special bumping on the die’s bond pads. Typically the bump material is made of gold with approximately 25 um of height. The flip-chip assembly process att aches the bumped area to the antenna tr aces. Several bumping and flip chip assembly methods are available for RFID t ags. The wire bonding method needs a relatively simple process for the die attachment.
AN830 Datasheet
