Datasheet Summary
Limiter
Product Overview
The series of surface mount Limiter diodes utilize new and unique monolithic MMSM technology. The technology is a package/device integration acplished at the wafer fabrication level. Since the cathode and anode interconnections utilize precision photolithographic techniques rather than wire bonds, parasitic package inductance is tightly controlled. The package parasitics provide smooth non- resonant functionality through X-Band. This series of devices meets RoHS requirements.
Key Features
- Up to 10W incident RF power handling
- Anti- parallel configuration available
- LP = 0.02 nH typical
- CP = 0.04 pF typical
- Broadband performance through X- band
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