93C66B Datasheet | Microchip Technology

Features - Low-Power CMOS Technology - ORG Pin to Select Word Size for ‘66C’ Version - 512 x 8-bit Organization ‘A’ Devices (no ORG) - 256 x 16-bit organization ‘B’ Devices (no ORG) - Self-t Imed Erase/Write Cycles (including Auto-Erase) - Automatic Erase All (ERAL) Before Write All (WRAL) - Power-On/Off Data Protection Circuitry - Industry Standard Three-Wire Serial I/O - Device Status Signal (Ready/Busy) - Sequential Read Function - High Reliability: - Endurance: 1,000,000 erase/write cycles - Data retention: > 200 years - ESD protection: > 4000V - Ro HS pliant - Temperature Ranges Supported: - Industrial (I) -40°C to +85°C - Extended (E) -40°C to +125°C - Automotive AEC-Q100 Qualified Pin Function Table Name Function CS CLK DI DO VSS NC ORG VCC Chip Select Serial Data Clock Serial Data Input Serial Data Output Ground No internal connection Memory Configuration Power Supply Description The Microchip Technology Inc. 93XX66A/B/C devices are 4-Kbit low-voltage serial Electrically Erasable PROMs (EEPROM). Word-selectable devices such as the 93AA66C, 93LC66C or 93C66C are dependent upon external logic levels driving the ORG pin to set word size. For dedicated 8-bit munication, the 93XX66A devices are available, while the 93XX66B devices provide dedicated 16-bit munication. Advanced CMOS technology makes these devices ideal for low-power, nonvolatile memory applications. Packages - 8-Lead DFN, 8-Lead MSOP, 8-Lead PDIP, 8-Lead SOIC, 6-Lead SOT-23, 8-Lead TDFN, 8-Lead TSSOP  2003-2022 Microchip Technology Inc. and its subsidiaries DS20001795F-page 1 93AA66A/B/C, 93LC66A/B/C, 93C66A/B/C Package Types (not to scale) DFN/TDFN MSOP/TSSOP PDIP/SOIC ROTATED SOIC CS...