MT29F64G08CECCB
Key Features
- Trench MOS Schottky technology
- Low forward voltage drop, low power losses
- High efficiency operation
- Low 2 VTS40100CT
- Meets MSL level 1, per J-STD-020C, LF max peak of 245 °C (for TO-263AB package)
- Solder dip 260 °C, 40 seconds (for TO-220AB, ITO-220AB & TO-262AA package)
- ponent in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC TYPICAL APPLICATIONS
