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Micron

MT5VDDT1672H Datasheet Preview

MT5VDDT1672H Datasheet

128MB DDR SDRAM Small-Outline DIMM

No Preview Available !

128MB, 256MB: (x72, ECC, SR) 200-Pin DDR SODIMM
Features
DDR SDRAM Small-Outline DIMM
MT5VDDT1672H – 128MB
MT5VDDT3272H – 256MB
For component data sheets, refer to Micron’s Web site: www.micron.com
Features
• 200-pin, small-outline dual in-line memory module
(SODIMM)
• Fast data transfer rates: PC-2100, PC-2700,
or PC-3200
• 128MB2 (16 Meg x 72) and 256MB (32 Meg x 72)
• Supports ECC error detection and correction
• VDD = VDDQ = +2.5V
• VDDSPD = +2.3V to +3.6V
• JEDEC-standard 2.5V I/O (SSTL_2-compatible)
• Commands entered on each positive CK edge
• DQS edge-aligned with data for READs; center-
aligned with data for WRITEs
• Internal, pipelined double data rate (DDR)
architecture; two data accesses per clock cycle
• Bidirectional data strobe (DQS) transmitted/
received with data (source-synchronous data
capture)
• Differential clock inputs (CK and CK#)
• Four internal device banks for concurrent operation
• Selectable burst lengths (BL): 2, 4, or 8
• Auto precharge option
• Auto refresh and self refresh modes: 7.8125µs
maximum average periodic refresh interval
• Serial presence-detect (SPD) with EEPROM
• Selectable READ CAS latency for maximum
compatibility
• Gold edge contacts
Figure 1: 200-Pin SODIMM (MO-224 R/C C)
Module height: 31.75mm (1.25in)
Options
Marking
• Operating temperature1
– Commercial (0°C TA +70°C)
– Industrial (–40°C TA +85°C)
• Package
– 200-pin SODIMM (standard)2
None
I
G
– 200-pin SODIMM (Pb-free)
Y
• Memory clock, frequency, CAS latency
– 5ns (200 MHz), 400 MT/s, CL = 3
-40B3
– 6ns (167 MHz), 333 MT/s, CL = 2.5
-335
– 7.5ns (133 MHz), 266 MT/s, CL = 2
-262
– 7.5ns (133 MHz), 266 MT/s, CL = 2
-26A
– 7.5ns (133 MHz), 266 MT/s, CL = 2.5
-265
• PCB height
– 31.75mm (1.25in)
Notes: 1. Contact Micron for industrial temperature
module offerings.
2. Consult factory for product availability.
3. -40B only available for 256MB modules.
Table 1:
Speed
Grade
-40B
-335
-262
-26A
-265
Key Timing Parameters
Industry Nomenclature
PC-3200
PC-2700
PC-2100
PC-2100
PC-2100
Data Rate (MT/s)
CL = 3
400
CL = 2.5
333
333
266
266
266
CL = 2
266
266
266
266
200
tRCD
(ns)
15
15
15
20
20
tRP
(ns)
15
15
15
20
20
tRC
(ns)
55
60
60
65
65
PDF: 09005aef80a8e793/Source: 09005aef80a8e767
dd5c16_32x72h.fm - Rev. F 2/07 EN
1 Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2004 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.




Micron

MT5VDDT1672H Datasheet Preview

MT5VDDT1672H Datasheet

128MB DDR SDRAM Small-Outline DIMM

No Preview Available !

128MB, 256MB: (x72, ECC, SR) 200-Pin DDR SODIMM
Features
Table 2: Addressing
Refresh count
Row addressing
Device bank addressing
Device configuration
Column addressing
Module rank addressing
128MB
8K
8K (A0–A12)
4 (BA0, BA1)
256Mb (16 Meg x 16)
512 (A0–A8)
1 (SO#)
256MB
8K
8K (A0–A12)
4 (BA0, BA1)
512Mb (32 Meg x 16)
1K (A0–A9)
1 (SO#)
Table 3:
Part Numbers and Timing Parameters 128MB
Base device: MT46V16M161, 256Mb DDR SDRAM
Part Number2
MT5VDDT1672H(I)G-335__
MT5VDDT1672H(I)Y-335__
MT5VDDT1672H(I)G-262__
MT5VDDT1672H(I)Y-262__
MT5VDDT1672H(I)G-26A__
MT5VDDT1672H(I)Y-26A__
MT5VDDT1672H(I)G-265__
MT5VDDT1672H(I)Y-265__
Module
Density
128MB
128MB
128MB
128MB
128MB
128MB
128MB
128MB
Configuration
16 Meg x 72
16 Meg x 72
16 Meg x 72
16 Meg x 72
16 Meg x 72
16 Meg x 72
16 Meg x 72
16 Meg x 72
Module
Bandwidth
2.7 GB/s
2.7 GB/s
2.1 GB/s
2.1 GB/s
2.1 GB/s
2.1 GB/s
2.1 GB/s
2.1 GB/s
Memory Clock/
Data Rate
6ns/333 MT/s
6ns/333 MT/s
7.5ns/266 MT/s
7.5ns/266 MT/s
7.5ns/266 MT/s
7.5ns/266 MT/s
7.5ns/266 MT/s
7.5ns/266 MT/s
Latency
(CL-tRCD-tRP)
2.5-3-3
2.5-3-3
2-2-2
2-2-2
2-3-3
2-3-3
2.5-3-3
2.5-3-3
Table 4:
Part Numbers and Timing Parameters 256MB
Base device: MT46V32M161, 512Mb DDR SDRAM
Part Number2
MT5VDDT3272H(I)G-40B__
MT5VDDT3272H(I)Y-40B__
MT5VDDT3272H(I)G-335__
MT5VDDT3272H(I)Y-335__
Module
Density
256MB
256MB
256MB
256MB
Configuration
32 Meg x 72
32 Meg x 72
32 Meg x 72
32 Meg x 72
Module
Bandwidth
3.2 GB/s
3.2 GB/s
2.7 GB/s
2.7 GB/s
Memory Clock/
Data Rate
5ns/400 MT/s
5ns/400 MT/s
6ns/333 MT/s
6ns/333 MT/s
Latency
(CL-tRCD-tRP)
3-3-3
3-3-3
2.5-3-3
2.5-3-3
Notes:
1. Data sheets for the base device parts can be found on Micron’s Web site.
2. All part numbers end with a two-place code (not shown), designating component and PCB
revisions. Consult factory for current revision codes. Example: MT5VDDT1672HG-335F3.
PDF: 09005aef80a8e793/Source: 09005aef80a8e767
dd5c16_32x72h.fm - Rev. F 2/07 EN
2 Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2004 Micron Technology, Inc. All rights reserved.


Part Number MT5VDDT1672H
Description 128MB DDR SDRAM Small-Outline DIMM
Maker Micron
Total Page 16 Pages
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