Description
Ball Assignments and Descriptions Electrical Specifications Device Diagrams Package Dimensions 4Gb, 8Gb: x8, x16 NAND Flash Memory.
Features
- NAND Flash and Mobile LPDDR 168-Ball Package-on-Package (PoP) MCP Combination Memory (TI OMAP™)
MT29C4G48MAYAPAKQ-5 IT, MT29C4G48MAZAPAKQ-5 IT, MT29C4G48MAZAPAKQ-6 IT, MT29C4G96MAZAPCJG-5 IT, MT29C4G96MAZAPCJG-6 IT, MT29C8G96MAZAPDJV-5 IT, MT29C8G96MAZAPDJV-6 IT Features
Micron® NAND Flash and LPDDR components RoHS-compliant, “green” package Separate NAND Flash and LPDDR interfaces Space-saving multichip package/package-on-package combination.
- Low-voltage operation (1.70.
- 1.95V).