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  Microsemi Electronic Components Datasheet  

1N5552US Datasheet

VOIDLESS HERMETICALLY SEALED SURFACE MOUNT STANDARD RECOVERY GLASS RECTIFIERS

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1N5550US thru 1N5554US
Available on
commercial
versions
VOIDLESS HERMETICALLY SEALED SURFACE
MOUNT STANDARD RECOVERY GLASS RECTIFIERS
Qualified to MIL-PRF-19500/420
DESCRIPTION
This “standard recovery” surface mount rectifier diode series is military qualified and is ideal
for high-reliability applications where a failure cannot be tolerated. These industry-recognized
5.0 amp rated rectifiers for working peak reverse voltages from 200 to 1000 volts are
hermetically sealed with voidless-glass construction using an internal “Category 1
metallurgical bond. These devices are also available in axial-leaded packages for thru-hole
mounting. Microsemi also offers numerous other rectifier products to meet higher and lower
current ratings with various recovery time speeds.
Important: For the latest information, visit our website http://www.microsemi.com.
FEATURES
Surface mount equivalent of JEDEC registered 1N5550 thru 1N5554 series.
Voidless hermetically sealed glass package.
Extremely robust construction.
Quadruple-layer passivation.
Internal “Category 1” metallurgical bonds.
JAN, JANTX, JANTXV and JANS qualified versions available per MIL-PRF-19500/420.
RoHS compliant versions available (commercial grade only).
APPLICATIONS / BENEFITS
Standard recovery 5 amp 200 to 1000 volts rectifiers series.
Military and other high-reliability applications.
General rectifier applications including bridges, half-bridges, catch diodes, etc.
High forward surge current capability.
Low thermal resistance.
Controlled avalanche with peak reverse power capability.
Extremely robust construction.
Inherently radiation hard as described in Microsemi “MicroNote 050”.
MAXIMUM RATINGS @ TA = 25 oC unless otherwise noted.
Qualified Levels:
JAN, JANTX, JANTXV
and JANS
“B” SQ-MELF (D-5B)
Package
Also available in:
“B” Package
(axial-leaded)
1N5550 – 1N5554
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-End Cap
Thermal Impedance @ 10 ms heating time (1)
Maximum Forward Surge Current (8.3 ms half sine)
Average Rectified Forward Current (2) @ TEC = 130 oC
Average Rectified Forward Current (3) @ TA = 55 oC
@ TA = 100 oC
Working Peak Reverse Voltage
1N5550US
1N5551US
1N5552US
1N5553US
1N5554US
Solder Temperature @ 10 s
See notes on next page.
Symbol
TJ and TSTG
R ӨJEC
Z ӨJX
IFSM
I O(L)
I O2 (2)
I O3 (4)
V RWM
TSP
Value
-65 to +175
6.5
1.5
100
5
3
2
200
400
600
800
1000
260
Unit
oC
oC/W
oC/W
A
A
A
A
V
OC
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
T4-LDS-0230-1, Rev. 1 (111901)
©2011 Microsemi Corporation
Page 1 of 5


  Microsemi Electronic Components Datasheet  

1N5552US Datasheet

VOIDLESS HERMETICALLY SEALED SURFACE MOUNT STANDARD RECOVERY GLASS RECTIFIERS

No Preview Available !

1N5550US thru 1N5554US
MAXIMUM RATINGS
Notes: 1. Derate linearly at 66.6 mA/ºC above T EC = 100 ºC. An IO of up to 6 Amps is allowable provided that appropriate heat sinking or forced air
cooling maintains the junction temperature at or below +200 oC.
2. Derate linearly at 22.2 mA/ºC from +55 ºC to +100 oC.
3. These IO ratings are for a thermally (PC boards or other) mounting methods where the lead or end-cap temperatures cannot be maintained
and where thermal resistance from mounting point to ambient is still sufficiently controlled where T J(MAX) does not exceed 175 oC. This
equates to R θJX ≤ 47 ºC/W.
4. Derate linearly at 26.7 mA/°C above T A= +100 °C to +175 °C ambient.
MECHANICAL and PACKAGING
CASE: Hermetically sealed voidless hard glass with tungsten slugs.
TERMINALS: End caps are copper with tin/lead (Sn/Pb) finish. RoHS compliant matte-tin is available for commercial only.
MARKING: Cathode band only.
POLARITY: Cathode indicated by band.
TAPE & REEL option: Standard per EIA-481-B. Consult factory for quantities.
WEIGHT: 539 milligrams.
See Package Dimensions and recommended Pad Layout on last page.
Reliability Level
JAN = JAN Level
JANTX = JANTX Level
JANTXV = JANTXV Level
JANS = JANS Level
Blank = Commercial
JEDEC type number
See Electrical Characteristics
table
PART NOMENCLATURE
JAN 1N5550 US (e3)
RoHS Compliance
e3 = RoHS compliant (available
on commercial grade only)
Blank = non-RoHS compliant
MELF Package
Symbol
V BR
V RWM
IO
VF
IR
t rr
SYMBOLS & DEFINITIONS
Definition
Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current.
Working Peak Reverse Voltage: The maximum peak voltage that can be applied over the operating temperature range
excluding all transient voltages (ref JESD282-B).
Average Rectified Output Current: The Output Current averaged over a full cycle with a 50 Hz or 60 Hz sine-wave
input and a 180 degree conduction angle.
Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current.
Maximum Reverse Current: The maximum reverse (leakage) current that will flow at the specified voltage and
temperature.
Reverse Recovery Time: The time interval between the instant the current passes through zero when changing from
the forward direction to the reverse direction and a specified decay point after a peak reverse current occurs.
T4-LDS-0230-1, Rev. 1 (111901)
©2011 Microsemi Corporation
Page 2 of 5


Part Number 1N5552US
Description VOIDLESS HERMETICALLY SEALED SURFACE MOUNT STANDARD RECOVERY GLASS RECTIFIERS
Maker Microsemi
Total Page 5 Pages
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