1N6309 thru 1N6355D
Available on
commercial
versions
VOIDLESS HERMETICALLY SEALED
500mW GLASS ZENER DIODES
Qualified per MIL-PRF-19500/533
DESCRIPTION
This Zener voltage regulator series is military qualified and is ideal for high-reliability
applications where a failure cannot be tolerated. These industry-recognized 0.5 watt Zener
voltage regulators are hermetically sealed with voidless-glass construction using an internal
metallurgical bond. It includes Zener selections from 2.4 to 200 volts in standard 5%
tolerances as well as 1% and 2% tolerances. They are also available in surface-mount
packages. Microsemi also offers numerous other Zener products to meet higher and lower
power ratings in both thru-hole and surface mount packages.
Important: For the latest information, visit our website http://www.microsemi.com.
FEATURES
• JEDEC registered 1N6309 thru 1N6355 series.
• Voltage tolerances of 1%, 2% and 5% are available. (See part nomenclature.)
• Voidless hermetically sealed glass package.
• Internal “Category 1” metallurgical bonds for 1N6321 thru 1N6355 and “Category III” for 1N6309
thru 1N6320.
• JAN, JANTX, JANTXV, and JANS reliability levels are available per MIL-PRF-19500/533.
• RoHS compliant versions available (commercial grade only).
APPLICATIONS / BENEFITS
• Small DO-35 size package (or “D” Package).
• Regulates voltage over a broad operating current and temperature range.
• Extensive selection from 2.4 to 200 volts.
• Standard and tight voltage tolerances available.
• Extremely robust construction.
• Flexible axial-lead mounting terminals.
• Non-sensitive to ESD per MIL-STD-750 method 1020.
• Inherently radiation hard as described in Microsemi “MicroNote 050”.
Qualified Levels:
JAN, JANTX, JANTXV
and JANS
DO-35 or
“D” Package
Also available in:
“B” SQ MELF package
(surface mount)
1N6309US – 1N6355DUS
MAXIMUM RATINGS
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-Lead (1)
1N6309 – 1N6320
1N6321 – 1N6355
Thermal Resistance Junction-to-Ambient (2)
Steady-State Power Dissipation @ TL = 75 oC
Forward Voltage @ 1.0 A
Solder Temperature @ 10 s
Symbol
TJ and TSTG
R ӨJL
R ӨJA
PD
VF
T SP
Value
-65 to +175
150
95.5
240
0.5
1.4
260
Unit
oC
oC/W
oC/W
W
V
oC
Notes:
1. At 3/8 inch (10 mm) from body. See Figure 1 and Figure 2 for derating.
2. TA = +55 °C before derating on printed circuit board (PCB), PCB = FR4 .0625 inch (1.59 mm) 1-layer 1-
Oz Cu, horizontal, still air, pads = .092 inch (2.34 mm) diameter, strip = .030 inch (0.76 mm) x 1 inch
(25.4 mm) long, axial lead length L ≤ .187 inch (≤ 4.75 mm); RΘJA with a defined thermal resistance
condition included is measured at IZ = as defined in the characteristics and ratings table herein.
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
T4-LDS-0193, Rev. 2 (111899)
©2011 Microsemi Corporation
Page 1 of 6
