1PMT5914B Datasheet | Microsemi

DESCRIPTION ® In Microsemi's Powermite surface mount package, these zener diodes provide power-handling capabilities (3.0 WATTS) found in larger packages. ® In addition to its size advantages, Powermite package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment. DO-216 FEATURES - Surface Mount Packaging - Integral Heat Sink Locking Tabs - patible with automatic insertion equipment - Full metallic bottom eliminates flux entrapment - Zener voltage 3.3 to 200 Volts - Low reverse leakage - Tight tolerance available - ESD Rating of >16k V per human body model MAXIMUM RATINGS - Junction and storage temperatures: -55°C to +150°C - DC power dissipation: 3.0 watt with TAB 1 60°C - Forward voltage: @ 200 m A 1.2 volts Mechanical Specifications CIRCUIT DIAGRAM MECHANICAL CHARACTERISTICS - Cathode designated by TAB 1 - Mounting position any way - Molded package - Weight: 0.016 gram (approximate) P- ack Tahegrimnagl resistance 30°C/W junction to TAB1 - PACTa Kp Ae G& IRNe Gel EIA Standard 481 - Tape & Reel EIA Standard 481 - 7 inch 3,000 pieces - 13 inch 12,000 pieces Mounting Pad Dimensions All dimensions +/- .005 inches MSC0995.PDF ISO 9001 CERTIFIED Inches REV F 11/01/99 Electrical Characteristics @ TL = 30°°C MICROSEMI NUMBER DEVICE...