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1N5809US Datasheet

(1N5807US - 1N5811US) SURFACE MOUNT VOIDLESSHERMETICALLY- SEALED ULTRA FAST RECOVERY GLASS RECTIFIERS

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SCOTTSDALE DIVISION
1N5807US thru 1N5811US
SURFACE MOUNT VOIDLESS-
HERMETICALLY-SEALED ULTRA FAST
RECOVERY GLASS RECTIFIERS
DESCRIPTION
APPEARANCE
This “Ultrafast Recovery” surface mount rectifier diode series is military qualified to
MIL-PRF-19500/477 and is ideal for high-reliability applications where a failure
cannot be tolerated. These industry-recognized 6.0 Amp rated rectifiers for working
peak reverse voltages from 50 to 150 volts are hermetically sealed with voidless-
glass construction using an internal “Category I” metallurgical bond. These devices
are also available in axial-leaded package configurations (see separate data sheet
for 1N5807 thru 1N5811). Microsemi also offers numerous other rectifier products
to meet higher and lower current ratings with various recovery time speed
requirements including standard, fast, and ultrafast device types in both through-
hole and surface mount packages.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
Package “E”
or D-5B
FEATURES
APPLICATIONS / BENEFITS
Surface mount package series equivalent to the
JEDEC registered 1N5807 to 1N5811 series
Voidless-hermetically-sealed glass package
Extremely robust construction
Triple-layer passivation
Internal “Category I” Metallurgical bonds
JAN, JANTX, JANTXV, and JANS available per MIL-
PRF-19500/477
Axial-leaded equivalents also available (see separate
data sheet for 1N5807 thru 1N5811)
Ultrafast recovery 6 Amp rectifiers series 50 to 150 V
Military and other high-reliability applications
Switching power supplies or other applications
requiring extremely fast switching & low forward loss
High forward surge current capability
Low thermal resistance
Controlled avalanche with peak reverse power
capability
Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
Operating Temperature: -65oC to +175oC.
Storage Temperature: -65oC to +175oC.
Average Rectified Forward Current (IO): 6 Amps @
TEC = 75ºC End Cap temperature (see note 1)
Thermal Resistance: 10 ºC/W junction to end cap
Thermal Impedance: 1.5 ºC/W @ 10 ms heating time
Forward Surge Current (8.3 ms half sine) 125 Amps
Solder temperature: 260ºC for 10 s (maximum)
MECHANICAL AND PACKAGING
CASE: Hermetically sealed voidless hard glass
with Tungsten slugs
TERMINALS: End caps are solid Silver with
Tin/Lead (Sn/Pb) finish
MARKING & POLARITY: Cathode band only
Tape & Reel option: Standard per EIA-481-B
Weight: 539 mg
See package dimensions and recommended pad
layout on last page
ELECTRICAL CHARACTERISTICS
TYPE
WORKING
PEAK
REVERSE
VOLTAGE
VRWM
VOLTS
BREAKDOWN
VOLTAGE
(MIN.)
@ 100µA
VBR
VOLTS
AVERAGE
RECTIFIED
CURRENT
IO1
@TEC=75ºC
(Note 1)
AMPS
1N5807US
50
60
6.0
AVERAGE
RECTIFIED
CURRENT
IO2
@TA=55ºC
(Note 2)
AMPS
3.0
MAXIMUM
FORWARD
VOLTAGE
@4A
(8.3 ms pulse)
VF
VOLTS
25oC 100oC
0.875 0.800
REVERSE
CURRENT
(MAX)
@ VRWM
IR
µA
25oC 100oC
5 150
SURGE
CURRENT
(MAX)
IFSM
(NOTE 3)
AMPS
125
REVERSE
RECOVERY
TIME (MAX)
(NOTE 4)
trr
ns
30
1N5809US
100
110
6.0
3.0 0.875 0.800 5 150
125
30
1N5811US
150
160
6.0
3.0 0.875 0.800 5 150
125
30
NOTE 1: Rated at TEC = 75ºC. Derate at 60 mA/ºC for TEC above 75ºC
NOTE 2: Derate linearly at 25 mA/ºC above TA = 55ºC. This rating is typical for PC boards where thermal resistance from mounting point to
ambient is sufficiently controlled where TJ(max) does not exceed 175ºC
NOTE 3: TA = 25oC @ IO = 3.0 A and VRWM for ten 8.3 ms surges at 1 minute intervals
NOTE 4: IF = 1.0 A, IRM = 1.0 A, IR(REC) = 0.10 A and di/dt = 100 A/µs min
Copyright 2004
1-14-2005 REV B
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1


  Microsemi Electronic Components Datasheet  

1N5809US Datasheet

(1N5807US - 1N5811US) SURFACE MOUNT VOIDLESSHERMETICALLY- SEALED ULTRA FAST RECOVERY GLASS RECTIFIERS

No Preview Available !

SCOTTSDALE DIVISION
1N5807US thru 1N5811US
SURFACE MOUNT VOIDLESS-
HERMETICALLY-SEALED ULTRA FAST
RECOVERY GLASS RECTIFIERS
Symbol
VBR
VRWM
VF
IR
C
trr
SYMBOLS & DEFINITIONS
Definition
Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current.
Working Peak Reverse Voltage: The maximum peak voltage that can be applied over the operating
temperature range.
Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current.
Maximum Leakage Current: The maximum leakage current that will flow at the specified voltage and
temperature.
Capacitance: The capacitance in pF at a frequency of 1 MHz and specified voltage
Reverse Recovery Time: The time interval between the instant the current passes through zero when
changing from the forward direction to the reverse direction and a specified recovery decay point after a peak
reverse current is reached.
GRAPHS
FIGURE 1
TYPICAL FORWARD CURRENT
vs. FORWARD VOLTAGE
FIGURE 2
TYPICAL REVERSE CURRENT vs. VOLTAGE
FIGURE 3
FORWARD PULSE CURRENT vs. DURATION
Copyright 2004
1-14-2005 REV B
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 2


Part Number 1N5809US
Description (1N5807US - 1N5811US) SURFACE MOUNT VOIDLESSHERMETICALLY- SEALED ULTRA FAST RECOVERY GLASS RECTIFIERS
Maker Microsemi Corporation
Total Page 3 Pages
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