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  Microsemi Electronic Components Datasheet  

LX5551 Datasheet

Wireless LAN Power Amplifier

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TM
LX5551
® 2.4-2.5 GHz Front-End Module with Internally
Matched Power Amplifier & SPDT for 11b/g/n
PRODUCTION DATA SHEET
DESCRIPTION
LX5551 is a high-performance The Rx path of LX5551 includes a
WLAN front-end module (FEM) for low-cost SPDT switch with excellent
802.11b/g/n and other applications in insertion loss and isolation. It features a
the 2.4-2.5GHz frequency range. very low Tx-to-Rx port leakage in
LX5551 integrates an advanced receive mode.
InGaP/GaAs Heterojunction Bipolar LX5551 is available in a 16-pin,
Transistor (HBT) power amplifier with 3x3mm micro-lead package (MLPQ-
both input/output impedance matching, 16L). With its best-class performance
and an InGaAs pseudomorphic HEMT and compact footprint, LX5551 offers an
(pHEMT) switch, into a single 3x3mm ideal front-end solution for the ever
package.
demanding design requirements of
The Tx path of LX5551 features a today’s WLAN systems, including
two-stage monolithic microwave 802.11b/g and the latest 11n MIMO
integrated circuit (MMIC) power implementation.
amplifier with active bias circuitry, and
50 Ω input/output matching inside the
package. With 3.3V supply voltage and
90mA nominal bias current, the Tx
path provides 27dB gain and +18dBm
linear output power, with extremely low
total EVM (<3%) for 64QAM/54Mbps
OFDM. Both gain and power are
readily measured at antenna port, with
switch insertion loss included.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
KEY FEATURES
ƒ 2.4-2.5GHz 11b/g/n Front-End
Solution in a Single 3x3mm
MLP Package
ƒ All RF Ports Matched to 50 Ω
ƒ Single-Polarity 3.3V Supply
ƒ Tx Path Power Gain ~ 27dB
ƒ Rx Path Loss ~ 0.6dB
ƒ Pout ~ +18dBm at Antenna* for
EVM = 3%
ƒ Total Current ~140mA for
+18dBm with 90% Duty Cycle
ƒ Pout > +22dBm for 11b 1Mbps
DSSS Mask Compliance
ƒ Small Footprint: 3x3mm2
ƒ Low Profile: 0.9mm
ƒ RoHS Compliant & Pb-Free
* Including SPDT switch loss
APPLICATIONS
ƒ IEEE 802.11b/g
ƒ IEEE 802.11n MIMO
BLOCK DIAGRAM
Vref Vc
Ctl1 Ctl2
TxIn
Det
RxOut
Internal
OMN*
*OMN: Output Matching Network
Antenna
Copyright © 2008
Rev. 1.0, 2008-12-17
Microsemi
Analog Mixed Signal Group
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 1


  Microsemi Electronic Components Datasheet  

LX5551 Datasheet

Wireless LAN Power Amplifier

No Preview Available !

www.DataSheet4U.com
TM
LX5551
® 2.4-2.5 GHz Front-End Module with Internally
Matched Power Amplifier & SPDT for 11b/g/n
PRODUCTION DATA SHEET
PRODUCT HIGHLIGHT
MSC
5551
720A
PACKAGE ORDER INFO
Plastic MLPQ
16 pin 3x3mm
LQ RoHS Compliant /Pb-Free
LX5551LQ
Note: Available in Tape & Reel.
Append the letters “TR” to the part number.
(i.e. LX5551LQ-TR)
ABSOLUTE MAXIMUM RATINGS
DC Supply Voltage, RF off (PA).......................................................................5V
(Switch) ................................................................5V
Collector Current (PA)................................................................................500mA
Total Power Dissipation....................................................................................2W
RF Input Power............................................................................................10dbm
Maximum Junction Temperature (Tj max) ................................................ +150°C
Operation Ambient Temperature ...................................................-40°C to +85°C
Storage Temperature....................................................................-65°C to +150°C
RoHs/Pb Free Peak Package Solder Reflow Temperature (40 seconds maximum
exposure)…………………………………………………….…..260°C(+0, -5)
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal.
PACKAGE PIN OUT
Vcc Open Vc1 Open
TxIn
Vref
Det
RxOut
16 15 14 13
1 12
2 11
3 10
49
5678
Vc2
Open
PAOut
SwIn
Ctl1 Ant Ctl2 Optional
LQ PACKAGE
(“See-Through” View from Top)
THERMAL DATA
LQ Plastic MLPQ 16-Pin
THERMAL RESISTANCE-JUNCTION TO CASE, θJC
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
17°C/W
55.2°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJA).
The θJA numbers are guidelines for the thermal performance of the device/pc-board system. All of the
above assume no ambient airflow.
RoHS/Pb-free 100% Matte Tin Lead finish
Copyright © 2008
Rev. 1.0, 2008-12-17
Microsemi
Analog Mixed Signal Group
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2


Part Number LX5551
Description Wireless LAN Power Amplifier
Maker Microsemi Corporation
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