LX5551 Datasheet | Microsemi

DESCRIPTION KEY FEATURES . Microsemi . C OM LX5551 is a high-performance WLAN front-end module (FEM) for 802.11b/g/n and other applications in the 2.4-2.5GHz frequency range. LX5551 integrates an advanced In Ga P/Ga As Heterojunction Bipolar Transistor (HBT) power amplifier with both input/output impedance matching, and an In Ga As pseudomorphic HEMT (p HEMT) switch, into a single 3x3mm package. The Tx path of LX5551 features a two-stage monolithic microwave integrated circuit (MMIC) power amplifier with active bias circuitry, and 50 Ω input/output matching inside the package. With 3.3V supply voltage and 90m A nominal bias current, the Tx path provides 27d B gain and +18d Bm linear output power, with extremely low total EVM (<3%) for 64QAM/54Mbps OFDM. Both gain and power are readily measured at antenna port, with switch insertion loss included. The Rx path of LX5551 includes a low-cost SPDT switch with excellent insertion loss and isolation. It features a very low Tx-to-Rx port leakage in receive mode. LX5551 is available in a 16-pin, 3x3mm micro-lead package (MLPQ16L). With its best-class performance and pact footprint, LX5551 offers an ideal front-end solution for the ever demanding design requirements of today’s WLAN systems, including 802.11b/g and the latest 11n MIMO implementation. - 2.4-2.5GHz 11b/g/n Front-End Solution in a Single 3x3mm MLP Package - All RF Ports Matched to 50 Ω - Single-Polarity 3.3V Supply - Tx Path Power Gain ~ 27d B - Rx Path Loss ~ 0.6d B - Pout ~ +18d Bm at Antenna- for EVM = 3% - Total Current ~140m A for +18d Bm with 90% Duty Cycle - Pout > +22d Bm for 11b 1Mbps DSSS Mask pliance 2 - Small Footprint: 3x3mm - Low Profile: 0.9mm - Ro HS pliant & Pb-Free - Including SPDT switch loss APPLICATIONS - IEEE 802.11b/g - IEEE 802.11n MIMO BLOCK DIAGRAM IMPORTANT: For the most current data, consult MICROSEMI’s website: http://.microsemi. Vref Vc Ctl1 Ctl2 Tx In Det Rx Out Internal OMN- Antenna - OMN: Output Matching Network Copyright ©...