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THIN FILM CHIP RESISTORS
MSTF 2 SERIES
MECHANICAL DA TA DAT
SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BACKSIDE SURFACE 0.020" x 0.020" (±0.003") x 0.010" (±0.003") SILICON, ALUMINA, QUARTZ, OR GLASS NICHROME OR T ANT ALUM NITRIDE TANT ANTALUM 15,000 Å MINIMUM GOLD 10,000 Å MINIMUM ALUMINUM OPTIONAL BARE SUBSTRA TE SUBSTRATE GOLD BACK OPTIONAL
0.020"
A
ELECTRICAL DA TA DAT
0.020"
RESIST ANCE RANGE RESISTANCE SILICON, QUARTZ, GLASS ALUMINA ABSOLUTE TOLERANCE T.C.R. SILICON, QUARTZ, GLASS ALUMINA NICHROME 2Ω TO 1.5MΩ 2Ω TO 300KΩ 0.1%, 0.5%, 1%, 2%, 5%, 10% TO 0.01% AVAILABLE ±50ppm/°C ST ANDARD STANDARD OPTIONAL TO ±5ppm/°C ±50ppm/°C ST ANDARD STANDARD OPTIONAL TO ±25ppm/°C TANT ALUM NITRIDE ANTALUM 2Ω TO 1.5MΩ 2Ω TO 300KΩ 0.1%, 0.5%, 1%, 2%, 5%, 10% TO 0.
MSTF2 Datasheet
