• Part: PM300CLA060
  • Description: FLAT-BASE TYPE INSULATED PACKAGE
  • Manufacturer: Mitsubishi Electric
  • Size: 126.85 KB
Download PM300CLA060 Datasheet PDF
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Datasheet Summary

.. MITSUBISHI <INTELLIGENT POWER MODULES> FLAT-BASE TYPE INSULATED PACKAGE FEATURE a) Adopting new 5th generation IGBT (CSTBT) chip, which performance is improved by 1µm fine rule process. For example, typical Vce(sat)=1.5V @Tj=125°C b) I adopt the over-temperature conservation by Tj detection of CSTBT chip, and error output is possible from all each conservation upper and lower arm of IPM. - 3φ 300A, 600V Current-sense IGBT type inverter - Monolithic gate drive & protection logic - Detection, protection & status indication circuits for, shortcircuit, over-temperature & under-voltage (P-Fo available from upper arm devices) - Acoustic noise-less...