Download the BC846ALT1 datasheet PDF.
This datasheet also includes the BC848BLT1 variant, as both parts are published together in a single manufacturer document.
MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by BC846ALT1/D www.DataSheet4U.
Key Features
= 150°C.
25°C 556°C/W = 225 milliwatts
The 556°C/W for the SOT.
23 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. There are other alternatives to achieving higher power dissipation from the SOT.
23 package. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad™. Using a board material such as Thermal Clad, an aluminum core board,.