MMBTA20LT1 amplifier equivalent, general purpose amplifier.
the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process.
0.037 0.95
0.037 0.95
0.079 2.0 0.035.
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must .
Image gallery
Download