BCW30LT1 transistors equivalent, general purpose transistors.
ge. With the correct pad geometry, the packages will self align when subjected to a solder reflow process.
0.037 0.95
0.037 0.95
0.079 2.0 0.035 0.9 0.031 0.8
inches mm.
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must .
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