EB346 Datasheet - Motorola Inc

Semiconductor Products Sector Engineering Bulletin

EB346 Features

* 3 Input Power Changes One method to increase the operating frequency of an integrated circuit is to “shrink” the die (that is, reduce the die dimensions, both linearly and vertically). Reducing the die size can yield additional benefits, such as a reduction of power consumption, but can also resu

EB346 General Description

of the pinout change for the 144-pin TQFP package. Tolerant up to 3.6 V 144-pin TQFP or 196-pin PBGA Uses the following rules: For MF ≤ 4: CPCAP = [(680 × MF) * 120] pF For MF > 4: CPCAP = (1100 × MF) pF See Table 3 for details. Freescale Semiconductor, Inc I/O pins Package PLL input capac.

EB346 Datasheet (246.73 KB)

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EB346

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Motorola Inc

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246.73 KB

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Semiconductor products sector engineering bulletin.
Freescale Semiconductor, Inc. MOTOROLA Semiconductor Products Sector Engineering Bulletin Order Number EB346/D: Rev. 2 4/20/2001 Functional Differe.

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EB346 Semiconductor Products Sector Engineering Bulletin Motorola Inc

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