MC0063W060319K09 Datasheet | Multicomp

Features -   Small size and light weight -   Suitable for both wave and reflow soldering -   Reduction of assembly costs Performance Specification Temperature Coefficient : 1Ω to 10Ω ±400PPM/°C 11Ω to 100Ω ±200PPM/°C >100Ω ±100PPM/°C Short Time Overload : ±5% : ±(2% +0.1Ω)Max. ±1% : ±(1% +0.1Ω)Max. Insulation Resistance : Min. 1,000MΩ Dielectric Withstanding Voltage : No evidence of flashover, mechanical damage, arcing or insulation breakdown. Terminal Bending : ±(1% +0.05Ω) Max. Soldering Heat : ±(1% +0.05Ω) Max. Solderability : Min. 95% coverage Temperature Cycling : ±5% : ±(1% +0.05Ω) Max. ±1% : ±(0.5% +0.05Ω) Max. Humidity (Steady State) : ±5% : ±(3% +0.1Ω) Max. ±1% : ±(0.5% +0.1Ω) Max. Load Life in Humidity : ±5% : ±(3% +0.1Ω) Max. ±1% : ±(1% +0.1Ω) Max. Load Life : ±5% : ±(3% +0.1Ω) Max. ±1% : ±(1% +0.1Ω) Max. Derating Curve .element14. .farnell. .newark. Page <1> 13/01/14 V1.2 Free Datasheet http://.datasheet-pdf./ Thick Film Chip Resistor Dimension Ty...