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MMSZ5242B - Surface Mount Zener Diode

Description

Important Notice : This data sheet and its contents (the “Information”) belong to the members of the Premier Farnell group of companies (the “Group”) or are licensed to it.

Features

  •   Planar Die Construction.
  •   500mW Power Dissipation.
  •   General Purpose, Medium Current.
  •   Ideally Suited for Automated Assembly Processes.

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Datasheet Details

Part number MMSZ5242B
Manufacturer Multicomp
File Size 235.00 KB
Description Surface Mount Zener Diode
Datasheet download datasheet MMSZ5242B Datasheet

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Full PDF Text Transcription

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Surface Mount Zener Diode Features: •  Planar Die Construction •  500mW Power Dissipation •  General Purpose, Medium Current •  Ideally Suited for Automated Assembly Processes Applications: •  Zener diode •  Ultra-small surface mount package Maximum Rating @ Ta = 25°C unless otherwise specified Characteristic Symbol Value Forward voltage @ IF=10mA VF 0.9 Power dissipation Pd 500 Thermal resistance, junction to ambient air RθjA 350 Junction temperature Tj 150 Storage temperature range Tstg -65 to +150 Note : D evice mounted on ceramic PCB; 7.6mm × 9.4mm × 0.87mm with pad areas 25mm2. Tested with pulses, Tp ≤ 1ms.
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